Microchip SY100EP111UTG
Microchip SY100EP111UTG

Microchip SY100EP111UTG

Manufacturer No:

SY100EP111UTG

Manufacturer:

Microchip

Package:

32-TQFP

Description:

2.5V/3.3V 1:10 Differential LVPECL/LVECL/HSTL Clock Fanout Buffer

User Guide

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

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Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

SY100EP111UTG Information

Microchip SY100EP111UTG technical specifications, attributes, parameters and parts with similar specifications to Microchip SY100EP111UTG.

  • Type
  • Parameter
  • Buffer Type
  • Fanout
  • # of Outputs
  • 10
  • Diff. Outputs
  • LVPECL/LVECL/HSTL
  • Max Freq (MHz)
  • 3000
  • Max Within Device Skew (ps)
  • 25
  • Max Prop Delay (ps)
  • 400
  • Supply Voltage (V)
  • 2.5V, 3.3V
  • Operating Temperature Range (C)
  • -40 to 85
  • Package
  • 32L 7x7mm TQFP
  • Type
  • Parameter

Download datasheets and manufacturer documentation for Microchip SY100EP111UTG.

Data Sheets:

The SY100EP111U is a high-speed, low skew 1-to-10 differential fanout buffer designed for clock distribution in new, high-performance systems. The internal 2:1 MUX allows the input to select between two differential clock sources. The device is specifically designed for low skew. The interconnect scheme and metal layout are carefully optimized for minimal gate-to-gate skew within the device. Wafer characterization and process control ensure consistent distribution of propagation delay from lot to lot.



  • 2.5V and 3.3V Power Supply Options
  • fMAX = 3 GHz
  • Max 25 ps Output-to-Output Skew
  • 250 ps tr/tf
  • Max 400 ps Propagation Delay
  • Wide Temperature Range: –40°C to +85°C
  • Differential Design
  • VBB Output for Single-Ended Input Applications
  • Fully Compatible with Industry-Standard 100K I/O Levels
  • Available in 32-Lead TQFP Package

    • SY100EP111UTG Relevant information

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    Shipped from：HK Warehouse
    Expected Shipping：Mon, Apr 20 - Tue, Apr 21, 2026
    Date Code：Within 2 Years

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