STMicroelectronics STM32H755IIT3

STM32H755xI devices are based on the high-performance Arm^® Cortex^®-M7 and Cortex^®-M4 32-bit RISC cores. The Cortex^®-M7 core operates at up to 480 MHz and the Cortex^®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm^® single- and double-precision (Cortex^®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H755xI devices incorporate high-speed embedded memories with a dual-bank Flash memory of 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

• Dual core
  • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
• Memories
  • 2 Mbytes of Flash memory with read-while-write support
  • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
  • Dual mode Quad-SPI memory interface running up to 133 MHz
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
  • CRC calculation unit
• Security
  • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
• General-purpose input/outputs
  • Up to 168 I/O ports with interrupt capability
• Reset and power management
  • 3 separate power domains which can be independently clock-gated or switched off:
    • D1: high-performance capabilities
    • D2: communication peripherals and timers
    • D3: reset/clock control/power management
  • 1.62 to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
  • Embedded regulator (LDO) to supply the digital circuitry
  • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
  • Voltage scaling in Run and Stop mode (6 configurable ranges)
  • Backup regulator (~0.9 V)
  • Voltage reference for analog peripheral/VREF+
  • 1.2 to 3.6 V VBAT supply
  • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
• Low-power consumption
  • VBAT battery operating mode with charging capability
  • CPU and domain power state monitoring pins
  • 2.95 μA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
• Clock management
  • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
  • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
  • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
• Interconnect matrix
• 4 DMA controllers to unload the CPU
  • 1× high-speed master direct memory access controller (MDMA) with linked list support
  • 2× dual-port DMAs with FIFO
  • 1× basic DMA with request router capabilities
• Up to 35 communication peripherals
  • 4× I2Cs FM+ interfaces (SMBus/PMBus)
  • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
  • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
  • 4x SAIs (serial audio interface)
  • SPDIFRX interface
  • SWPMI single-wire protocol master I/F
  • MDIO Slave interface
  • 2× SD/SDIO/MMC interfaces (up to 125 MHz)
  • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
  • 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
  • Ethernet MAC interface with DMA controller
  • HDMI-CEC
  • 8- to 14-bit camera interface (up to 80 MHz)
• 11 analog peripherals
  • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
  • 1× temperature sensor
  • 2× 12-bit D/A converters (1 MHz)
  • 2× ultra-low-power comparators
  • 2× operational amplifiers (7.3 MHz bandwidth)
  • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters
• Graphics
  • LCD-TFT controller up to XGA resolution
  • Chrom-ART graphical hardware Accelerator™ (DMA2D) to reduce CPU load
  • Hardware JPEG Codec
• Up to 22 timers and watchdogs
  • 1× high-resolution timer (2.1 ns max resolution)
  • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
  • 2× 16-bit advanced motor control timers (up to 240 MHz)
  • 10× 16-bit general-purpose timers (up to 240 MHz)
  • 5× 16-bit low-power timers (up to 240 MHz)
  • 4× watchdogs (independent and window)
  • 2× SysTick timers
  • RTC with sub-second accuracy and hardware calendar
• Cryptographic acceleration
  • AES 128, 192, 256, TDES,
  • HASH (MD5, SHA-1, SHA-2), HMAC
  • True random number generators
• Debug mode
  • SWD & JTAG interfaces
  • 4-Kbyte Embedded Trace Buffer
• 96-bit unique ID
• Optional support of extended temperature range up to 125 °C (specific part numbers)