STMicroelectronics SPC582B54E3CD00X
Manufacturer No:
SPC582B54E3CD00X
Manufacturer:
STMicroelectronics
Package:
Description:
32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family
Quantity:
In Stock :1610
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Expected Shipping：Sat, May 30 - Sun, May 31, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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SPC582B54E3CD00X Information
STMicroelectronics SPC582B54E3CD00X technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics SPC582B54E3CD00X.
- Type
- Parameter
- Supply Voltage Min Volt
- 3.0
- Supply Voltage Max Volt
- 5.5
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 105.0
- Core
- e200z2
- ECCN US
- 5A991.b.4.a
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Automotive Safety
- Type
- Parameter
- Package Name
- TQFP 100 14x14x1.0
- Supply Voltage Min Volt
- 3.0
- Supply Voltage Max Volt
- 5.5
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 105.0
- Core
- e200z2
- ECCN US
- 5A991.b.4.a
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
Download datasheets and manufacturer documentation for STMicroelectronics SPC582B54E3CD00X.
Data sheet:
Material Declaration:
The SPC582Bx microcontroller is the entry member of a new family of devices superseding the SPC560Bx family.
SPC582Bx is built on the legacy of the SPC5x products, while introducing new features to answer the future requirements like the ASIL-B classification, high number of ISO CAN-FD channels, and provide significant power and performance improvement (MIPS per mW).
- AEC-Q100 qualified
- High performance e200z2 single core
- 32-bit power architecture technology CPU
- Core frequency as high as 80 MHz
- Variable length encoding (VLE)
- Floating point, End-to-End error correction
- 1088 KB (1024 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- 96 KB on-chip general-purpose SRAM
- Multi-channel direct memory access controller (eDMA) with 16 channels
- 1 interrupt controller (INTC)
- Comprehensive new generation ASIL-B safety concept
- ASIL-B of ISO 26262
- FCCU for collection and reaction to failure notifications
- Memory error management Unit (MEMU) for collection and reporting of error events in memories
- Cyclic redundancy check (CRC) unit
- End-to-end error correction code (e2eECC) logic
- Crossbar switch architecture for concurrent access to peripherals, flash, or RAM from multiple bus masters with end-to-end ECC
- Body cross triggering unit (BCTU)
- Triggers ADC conversions from any eMIOS channel
- Triggers ADC conversions from up to 2 dedicated PIT_RTIs
- 1 event configuration register dedicated to each timer event allows to define the corresponding ADC channel
- Synchronization with ADC to avoid collision
- 1 enhanced 12-bit SAR analog-to-digital converters
- Up to 27 channels
- enhanced diagnosis feature
- Communication interfaces
- 6 LINFlexD modules
- 4 deserial serial peripheral interface (DSPI) modules
- 7 MCAN interfaces with advanced shared memory scheme and ISO CAN FD support
- Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
- Nexus Class 3 debug and trace interface
- Boot assist flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART.
- Enhanced modular IO subsystem (eMIOS): up to 32 timed I/O channels with 16-bit counter resolution
- Advanced and flexible supply scheme
- On-chip voltage regulator for 1.2 V core logic supply.
- Junction temperature range -40 °C to 150 °C
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