NXP SPC5777CCK3MMO3

Manufacturer No:

SPC5777CCK3MMO3

Manufacturer:

NXP

Package:

516-BGA

Description:

8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 516-BGA

Quantity:

Delivery:

Payment:

In Stock :Available

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SPC5777CCK3MMO3 information

NXP SPC5777CCK3MMO3 technical specifications, attributes, parameters and parts with similar specifications to NXP SPC5777CCK3MMO3.

Type
Parameter

Factory Lead Time
16 Weeks

Mounting Type
Surface Mount

Package / Case
516-BGA

Surface Mount
YES

Operating Temperature
-40°C~125°C TA

Packaging
Tray

Series
MPC57xx

Published
2012

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
516

ECCN Code
5A992

Additional Feature
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

HTS Code
8542.31.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

JESD-30 Code
S-PBGA-B516

Supply Voltage-Max (Vsup)
1.32V

Supply Voltage-Min (Vsup)
1.2V

Oscillator Type
Internal

RAM Size
512K x 8

Voltage - Supply (Vcc/Vdd)
3V~5.5V

uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC

Core Processor
e200z7

Peripherals
DMA, LVD, POR, Zipwire

Clock Frequency
40MHz

Program Memory Type
FLASH

Core Size
32-Bit Tri-Core

Program Memory Size
8MB 8M x 8

Connectivity
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

Bit Size
32

Data Converter
A/D 16b Sigma-Delta, eQADC

Has ADC
YES

DMA Channels
YES

PWM Channels
YES

DAC Channels
NO

ROM (words)
8388608

On Chip Program ROM Width
8

RAM (bytes)
524288

Length
27mm

Height Seated (Max)
2.02mm

Width
27mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for NXP SPC5777CCK3MMO3.

Datasheets:

nxpusainc-spc5777cck3mme3-datasheets-3439.pdf

Environmental Information:

nxpusainc-tef6657hnv102k-environmentalinformation-9391.pdf

SPC5777CCK3MMO3 Features

On-chip modules available within the family include the following features:

Three dual issue, 32-bit CPU core complexes (e200z7), two of which run in lockstep

Power Architecture embedded specification compliance

Instruction set enhancement allowing variable length encoding (VLE), optional

encoding of mixed 16-bit and 32- bit instructions, for code size footprint

reduction

On the two computational cores: Signal processing extension (SPE1.1)

instruction support for digital signal processing (DSP)

Single-precision floating point operations

On the two computational cores: 16 KB I-Cache and 16 KB D-Cache

Hardware cache coherency between cores

16 hardware semaphores

3-channel CRC module

8 MB on-chip flash memory

Supports read during program and erase operations, and multiple blocks

allowing EEPROM emulation

512 KB on-chip general-purpose SRAM including 64 KB standby RAM

Two multichannel direct memory access controllers (eDMA)

64 channels per eDMA

Dual core Interrupt Controller (INTC)

Dual phase-locked loops (PLL s) with stable clock domain for peripherals and

frequency modulation (FM) domain for computational shell

Crossbar Switch architecture for concurrent access to peripherals, flash memory, or

RAM from multiple bus masters with End-To- End ECC

External Bus Interface (EBI) for calibration and application use

System Integration Unit (SIU)

Error Injection Module (EIM) and Error Reporting Module (ERM)

Four protected port output (PPO) pins

Boot Assist Module (B AM) supports serial bootload via CAN or SCI

Three second-generation Enhanced Time Processor Units (eTPUs)

32 channels per eTPU

Total of 36 KB code RAM

Total of 9 KB parameter RAM

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.