NXP SPC5777CCK3MME3
NXP SPC5777CCK3MME3

NXP SPC5777CCK3MME3

Manufacturer No:

SPC5777CCK3MME3

Manufacturer:

NXP

Package:

416-BGA

Description:

8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 416-BGA

User Guide

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PURCHASE

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

SPC5777CCK3MME3 Information

NXP SPC5777CCK3MME3 technical specifications, attributes, parameters and parts with similar specifications to NXP SPC5777CCK3MME3.

  • Type
  • Parameter
  • Factory Lead Time
  • 16 Weeks
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 416-BGA
  • Surface Mount
  • YES
  • Operating Temperature
  • -40°C~125°C TA
  • Packaging
  • Tray
  • Series
  • MPC57xx
  • Published
  • 2012
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Type
  • Parameter
  • Number of Terminations
  • 416
  • ECCN Code
  • 5A992
  • Additional Feature
  • ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Terminal Pitch
  • 1mm
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED

Download datasheets and manufacturer documentation for NXP SPC5777CCK3MME3.

Datasheets:

Environmental Information:

SPC5777CCK3MME3  Description


The SPC5777CCK3MME3 MCU  is from the MPC5777C series based on three dual issues, 32-bit CPU core complexes (e200z7), two of which run in lockstep.



SPC5777CCK3MME3 Features


  • 16 hardware semaphores

  • 3-channel CRC module

  • 8 MB on-chip flash memory

  • 512 KB on-chip general-purpose SRAM including 64 KB standby RAM

  • Two multichannel direct memory access controllers (eDMA)

  • Dual-core Interrupt Controller (INTC)

  • Dual phase-locked loops (PLLs) with stable clock domain for peripherals and frequency modulation (FM) domain for computational shell

  • Crossbar Switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters with End-To-End ECC

  • External Bus Interface (EBI) for calibration and application use

  • System Integration Unit (SIU)

  • Error Injection Module (EIM) and Error Reporting Module (ERM)

  • Four protected port output (PPO) pins

  • Boot Assist Module (BAM) supports serial bootload via CAN or SCI

  • Three second-generation Enhanced Time Processor Units (eTPUs)



SPC5777CCK3MME3 Applications


  • Industrial 


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Shipped from：HK Warehouse
Expected Shipping：Mon, Apr 20 - Tue, Apr 21, 2026
Date Code：Within 2 Years

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