

NXP SPC5676RDK3MVY1
Manufacturer No:
SPC5676RDK3MVY1
Manufacturer:
Package:
516-BBGA
Description:
6MB 6M x 8 FLASH e200z7 32-Bit Dual-Core Microcontroller MPC56xx Qorivva Series 1.2V 516-BBGA
Quantity:
Delivery:




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In Stock :Available
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SPC5676RDK3MVY1 information
NXP SPC5676RDK3MVY1 technical specifications, attributes, parameters and parts with similar specifications to NXP SPC5676RDK3MVY1.
- Type
- Parameter
- Factory Lead Time
- 14 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 516-BBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~125°C TA
- Packaging
- Tray
- Series
- MPC56xx Qorivva
- Published
- 2007
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 516
- ECCN Code
- 3A991.A.2
- HTS Code
- 8542.31.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 1.2V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- S-PBGA-B516
- Supply Voltage-Max (Vsup)
- 1.32V
- Supply Voltage-Min (Vsup)
- 1.14V
- Oscillator Type
- Internal
- RAM Size
- 384K x 8
- Voltage - Supply (Vcc/Vdd)
- 1.14V~1.32V
- uPs/uCs/Peripheral ICs Type
- MICROCONTROLLER
- Core Processor
- e200z7
- Peripherals
- DMA, POR, PWM
- Clock Frequency
- 40MHz
- Program Memory Type
- FLASH
- Core Size
- 32-Bit Dual-Core
- Program Memory Size
- 6MB 6M x 8
- Connectivity
- CANbus, EBI/EMI, SCI, SPI
- Bit Size
- 32
- Data Converter
- A/D 64x12b
- Has ADC
- YES
- DMA Channels
- YES
- PWM Channels
- YES
- DAC Channels
- NO
- Address Bus Width
- 32
- ROM (words)
- 6291456
- On Chip Program ROM Width
- 8
- External Data Bus Width
- 32
- RAM (bytes)
- 393216
- Length
- 27mm
- Height Seated (Max)
- 2.55mm
Download datasheets and manufacturer documentation for NXP SPC5676RDK3MVY1.
Environmental Information:
PCN Design/Specification:
SPC5676RDK3MVY1 Description
This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC5676R. The electrical specifications are preliminary and are from previous designs, design simulations, or initial evaluations. These specifications may not be fully tested or guaranteed at this early stage of the product life cycle, however, for production silicon, these specifications will be met. Finalized specifications will be published after complete characterization and device
qualifications have been completed.
SPC5676RDK3MVY1 Features
Two identical dual issues, 32-bit CPU core complexes
(e200z7), each with
? Power Architecture embedded specification compliance
? Instruction set enhancement allowing variable length
encoding (VLE), optional encoding of mixed 16-bit and
32-bit instructions, for code size footprint reduction
? Signal processing extension (SPE) instruction support
for digital signal processing (DSP)
? Single-precision floating point operations (FPU)
? 16 KB I-Cache and 16 KB D-Cache
? Hardware cache coherency between cores
16 Hardware semaphores
3 channel CRC module
6MB on-chip flash
? Supports reading during the program and erase operations, and
multiple blocks allowing EEPROM emulation
384KB on-chip general-purpose SRAM including 48KB of
standby RAM
Two multi-channel direct memory access controllers
(eDMA)
? 64 channels per eDMA
Dual-core Interrupt controller (INTC)
Phase-locked loop with FM modulation (FMPLL)
Crossbar switch architecture for concurrent access to
peripherals, flash, or RAM from multiple bus masters
External Bus Interface (EBI) for calibration and
application development
System integration unit (SIU) with error correction status
module (ECSM)
Four protected port output pins (PPO)
Boot assist module (BAM) supports serial bootload via
CAN or SCI
Three second-generation enhanced time processor units
(eTPU2)
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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