NXP SPC5121YVY400B
Manufacturer No:
SPC5121YVY400B
Manufacturer:
Package:
516-BBGA Exposed Pad
Description:
ROMless e300 32-Bit Microcontroller MPC5121e Series SPC5121 1.4V 516-BBGA Exposed Pad
Quantity:
User Guide
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
SPC5121YVY400B Information
NXP SPC5121YVY400B technical specifications, attributes, parameters and parts with similar specifications to NXP SPC5121YVY400B.
- Type
- Parameter
- Factory Lead Time
- 16 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 516-BBGA Exposed Pad
- Surface Mount
- YES
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- MPC5121e
- Published
- 2002
- JESD-609 Code
- e2
- Part Status
- Active
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 516
- ECCN Code
- 3A991.A.2
- Terminal Finish
- TIN COPPER/TIN SILVER
- HTS Code
- 8542.31.00.01
- Subcategory
- Microprocessors
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
Download datasheets and manufacturer documentation for NXP SPC5121YVY400B.
Environmental Information:
SPC5121YVY400B Description
The MPC5121e/MPC5 123 integrates a high-performance e300 CPU core based on the Power Architecture Technology with a rich set of peripheral functions focused on communications and systems integration.
SPC5121YVY400B Features
e300 Power Architecture processor core
Power modes include doze, nap, sleep, deep sleep, and
hibernate
AXE - Auxiliary Execution Engine
MBX Lite - 2D/3D graphics engine (not available in
MPC5123)
DIU - Display interface unit
DDR1, DDR2, and LPDDR/mobile-DDR SDRAM
memory controller
MEM- 128 KB on-chip SRAM
USB 2.0 OTG controller with integrated physical layer
(PHY)
DMA subsystem
EMB - Flexible multi-function external memory bus
interface
NFC - NAND flash controller
LPC - LocalPlus interface
10/100Base Ethernet
PCI interface, version 2.3
PATA - Parallel ATA integrated development environment
(IDE) controller
SATA - Serial ATA controller with integrated physical
layer (PHY)
SDHC - MMC/SD/SDIO card host controller
PSC - Programmable serial controller
r-c - inter-integrated circuit communication interfaces
S/PDIF - Serial audio interface
CAN - Controller area network
BDLC - J1850 interface
VIU- Video Input, ITU-656 compliant
RTC - On-Chip real-time clock
SPC5121YVY400B Relevant information
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