TI SN74ALVTH32374KR
TI SN74ALVTH32374KR

TI SN74ALVTH32374KR

Manufacturer No:

SN74ALVTH32374KR

Manufacturer:

TI

Package:

96-LFBGA

Description:

2.3V~2.7V 3V~3.6V 250MHz 32 Bit D-Type Flip Flop BOTTOM 74ALVTH32374 96 Pins 100?A 74ALVTH Series 96-LFBGA

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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SN74ALVTH32374KR information

TI SN74ALVTH32374KR technical specifications, attributes, parameters and parts with similar specifications to TI SN74ALVTH32374KR.

  • Type
  • Parameter
  • Lifecycle Status
  • LIFEBUY (Last Updated: 3 days ago)
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 96-LFBGA
  • Number of Pins
  • 96
  • Weight
  • 174.20782mg
  • Operating Temperature
  • -40°C~85°C TA
  • Packaging
  • Cut Tape (CT)
  • Series
  • 74ALVTH
  • JESD-609 Code
  • e0
  • Part Status
  • Last Time Buy
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 96
  • Type
  • D-Type
  • Terminal Finish
  • Tin/Lead (Sn/Pb)
  • Subcategory
  • FF/Latches
  • Packing Method
  • TR
  • Technology
  • BICMOS
  • Voltage - Supply
  • 2.3V~2.7V 3V~3.6V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 235
  • Supply Voltage
  • 2.5V
  • Reach Compliance Code
  • not_compliant
  • Base Part Number
  • 74ALVTH32374
  • Function
  • Standard
  • Qualification Status
  • Not Qualified
  • Output Type
  • Tri-State, Non-Inverted
  • Number of Elements
  • 4
  • Polarity
  • Non-Inverting
  • Supply Voltage-Max (Vsup)
  • 2.7V
  • Number of Ports
  • 2
  • Number of Bits
  • 32
  • Clock Frequency
  • 250MHz
  • Propagation Delay
  • 3.2 ns
  • Turn On Delay Time
  • 1 ns
  • Logic Function
  • D-Type, Flip-Flop
  • Current - Quiescent (Iq)
  • 100?A
  • Current - Output High, Low
  • 8mA 24mA; 32mA 64mA
  • Number of Bits per Element
  • 8
  • Max Propagation Delay @ V, Max CL
  • 3.2ns @ 3.3V, 50pF
  • Trigger Type
  • Positive Edge
  • Input Capacitance
  • 3.5pF
  • Power Supply Current-Max (ICC)
  • 5mA
  • Number of Input Lines
  • 3
  • Number of Output Lines
  • 1
  • Count Direction
  • UNIDIRECTIONAL

Download datasheets and manufacturer documentation for TI SN74ALVTH32374KR.

PCN Obsolescence/ EOL:

PCN Design/Specification:

SN74ALVTH32374KR Overview


96-LFBGAis the packaging method. The Cut Tape (CT)package contains it. T flip flop is configured with an output of Tri-State, Non-Inverted. This trigger is configured to use Positive Edge. In this case, the electronic component is mounted in the way of Surface Mount. The JK flip flop operates with an input voltage of 2.3V~2.7V 3V~3.6V volts. In the operating environment, the temperature is -40°C~85°C TA. It is an electronic flip flop with the type D-Type. This type of FPGA is a part of the 74ALVTH series. This D flip flop should not have a frequency greater than 250MHz. A total of 4elements are present in it. There is 100?A quiescent consumption. A total of 96terminations have been recorded. The 74ALVTH32374 family contains it. A voltage of 2.5V provides power to the D latch. This T flip flop has a capacitance of 3.5pF farads at the input. There is an electronic part that is mounted in the way of Surface Mount. The 96pins are designed into the board. This device exhibits a clock edge trigger type of Positive Edge. There is a FF/Latchesbase part number assigned to the RS flip flops. It is designed with 32bits. As soon as Vsup reaches 2.7V, the maximum supply voltage is reached. Considering its reliability, this T flip flop is well suited for TR. This flip flop has a total of 2ports. In order for the chip to function, it has 1output lines. A total of 3input lines have been provided.

SN74ALVTH32374KR Features


Cut Tape (CT) package
74ALVTH series
96 pins
32 Bits


SN74ALVTH32374KR Applications


There are a lot of Texas Instruments
SN74ALVTH32374KR Flip Flops applications.


  • Shift Registers
  • Storage Registers
  • Bounce elimination switch
  • Data storage
  • Data transfer
  • Latch
  • Registers
  • Memory
  • Frequency division
  • Memory

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Step1：Prepare product

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Step2：Desiccant Protection

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Step3：Vacuum Packaging

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Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

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Step6：Packaging Box

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