TI SM32C6713BGDPA20EP
TI SM32C6713BGDPA20EP

TI SM32C6713BGDPA20EP

Manufacturer No:

SM32C6713BGDPA20EP

Manufacturer:

TI

Package:

272-BBGA

Description:

1.253.3V CPLD TMS320C67x Series 32C6713 272 Pin 200MHz 1.26V 272-BBGA

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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SM32C6713BGDPA20EP information

TI SM32C6713BGDPA20EP technical specifications, attributes, parameters and parts with similar specifications to TI SM32C6713BGDPA20EP.

  • Type
  • Parameter
  • Lifecycle Status
  • ACTIVE (Last Updated: 4 days ago)
  • Factory Lead Time
  • 6 Weeks
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 272-BBGA
  • Number of Pins
  • 272
  • Weight
  • 3.141609g
  • Operating Temperature
  • -40°C~105°C TC
  • Packaging
  • Tray
  • Series
  • TMS320C67x
  • JESD-609 Code
  • e0
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 272
  • ECCN Code
  • 3A001.A.3
  • Type
  • Floating Point
  • Terminal Finish
  • Tin/Lead (Sn/Pb)
  • Additional Feature
  • ALSO REQUIRES 3.3V SUPPLY
  • HTS Code
  • 8542.31.00.01
  • Subcategory
  • Digital Signal Processors
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 220
  • Frequency
  • 200MHz
  • Base Part Number
  • 32C6713
  • Pin Count
  • 272
  • Operating Supply Voltage
  • 1.26V
  • Power Supplies
  • 1.253.3V
  • Interface
  • Host Interface, I2C, McASP, McBSP
  • Max Supply Voltage
  • 3.47V
  • Min Supply Voltage
  • 1.2V
  • Number of I/O
  • 16
  • Memory Type
  • SDRAM, SRAM
  • Supply Current-Max
  • 560mA
  • Bit Size
  • 32
  • Data Bus Width
  • 32b
  • Core Architecture
  • TMS320
  • Boundary Scan
  • YES
  • Low Power Mode
  • YES
  • Integrated Cache
  • YES
  • RAM (words)
  • 4096
  • Voltage - I/O
  • 3.30V
  • Number of Timers
  • 2
  • Number of External Interrupts
  • 4
  • Barrel Shifter
  • NO
  • Internal Bus Architecture
  • MULTIPLE

Download datasheets and manufacturer documentation for TI SM32C6713BGDPA20EP.

SM32C6713BGDPA20EP Overview


An electronic component available in package 272-BBGA.Tray packaging is provided for it.Its Floating Point status makes it ideal for a wide range of applications.It is mounted in the direction of Surface Mount as shown in the image below.If it is operating at the temperature of -40°C~105°C TC, then it will be operating normally.This refers to the analog voltage range that can be input or output from 3.30V.There are several digital signal processors in the TMS320C67x series, including this one.In terms of its uses, it has 272 terminations.1.26V provides the supply voltage for it.The 272 component has pins.There are 272 pins in its configuration.The base part number 32C6713 can be used to identify many associated parts.To operate at 200MHz frequency, the device has a specific design.Mounting is accomplished using Surface Mount.According to its specific characteristics, this device is classified in the subcategory Digital Signal Processors.In this device, the minimum voltage is 1.2V.It can be supplied with a maximum voltage of 3.47V.A supply voltage of 1.26V is required for its operation.It receives electricity from 1.253.3V.It can also provide more features of ALSO REQUIRES 3.3V SUPPLY.An architecture of TMS320 is adopted by this processor core.16 I/Os are included with the device.It uses the SDRAM, SRAM memory type.In industrial settings, 2 timers provide accurate feedback and event activation.Interrupts caused by an external source cause 4 interrupts.For data transfer, 16 DMA channels are available without overloading the CPU.

SM32C6713BGDPA20EP Features


Supplied in the 272-BBGA package
Operating supply voltage of 1.26V
16 I/Os
4 external interrupts


SM32C6713BGDPA20EP Applications


There are a lot of Texas Instruments
SM32C6713BGDPA20EP DSP applications.


  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
  • Signal processing for telecommunications
  • Control systems
  • Biomedical engineering

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