

NXP S9S08SG8E2CTJ
Manufacturer No:
S9S08SG8E2CTJ
Manufacturer:
Package:
20-TSSOP (0.173, 4.40mm Width)
Description:
8KB 8K x 8 FLASH 8-Bit Microcontroller S08 Series S9S08SG8 5V 20-TSSOP (0.173, 4.40mm Width)
Quantity:
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S9S08SG8E2CTJ information
NXP S9S08SG8E2CTJ technical specifications, attributes, parameters and parts with similar specifications to NXP S9S08SG8E2CTJ.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 20-TSSOP (0.173, 4.40mm Width)
- Surface Mount
- YES
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tube
- Series
- S08
- Published
- 1999
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 20
- ECCN Code
- EAR99
- Terminal Finish
- MATTE TIN
- HTS Code
- 8542.31.00.01
- Subcategory
- Microcontrollers
- Technology
- CMOS
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 5V
- Terminal Pitch
- 0.65mm
- Time@Peak Reflow Temperature-Max (s)
- 40
- Base Part Number
- S9S08SG8
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 5.5V
- Power Supplies
- 3/5V
- Supply Voltage-Min (Vsup)
- 2.7V
- Oscillator Type
- Internal
- Number of I/O
- 16
- Speed
- 40MHz
- RAM Size
- 512 x 8
- Voltage - Supply (Vcc/Vdd)
- 2.7V~5.5V
- uPs/uCs/Peripheral ICs Type
- MICROCONTROLLER
- Peripherals
- LVD, POR, PWM, WDT
- Program Memory Type
- FLASH
- Core Size
- 8-Bit
- Program Memory Size
- 8KB 8K x 8
- Connectivity
- I2C, LINbus, SCI, SPI
- Supply Current-Max
- 120mA
- Bit Size
- 8
- Data Converter
- A/D 12x10b
- Has ADC
- YES
- DMA Channels
- NO
- PWM Channels
- YES
- DAC Channels
- NO
- ROM (words)
- 8192
Download datasheets and manufacturer documentation for NXP S9S08SG8E2CTJ.
Datasheets:
Environmental Information:
S9S08SG8E2CTJ Description
The entry-level to mid-range 8-bit S9S08SG8E2CTJ microcontrollers (MCUs) from NXP are intended for LIN slave, general market, high-temperature (up to 150 °C ambient), and space-constrained applications. The SG's non-intrusive, single-wire background debug module (BDM), which enables register reading without halting chip operation, makes it simple to include in applications. Since modifications can be changed in-app and in real time, this cuts down on development time. Debug access is also made possible in restricted areas. By doing away with the requirement for an external crystal, low-voltage interrupt (LVI) circuit, voltage regulator, I/O mux, a watchdog circuit, analog-to-digital converter (ADC), and development tools, the SG helps to reduce costs, conserve board space, and increase quality with on-chip components. The S08EL and S08SL families share pins with the SG family. Due to its adaptability, upgrades and downgrades can be made without extensive board redesign or pricy, lengthy development cycles.
S9S08SG8E2CTJ Features
40 MHz core
4-32 KB flash range
256B-1 KB RAM range
1 analog comparator
Four package options
Up to 16-channel, 10-bit ADC
Single-wire background debug module (BDM)
In-circuit emulation (ICE) with real-time bus capture
1 universal asynchronous receiver/transmitter (UART), 1 serial peripheral interface (SPI), 1 inter-integrated circuit (IIC)
This product is included in NXP?.s product longevity program, with assured supply for a minimum of 15 years after launch
S9S08SG8E2CTJ Applications
Automotive
Braking and Stability Control
Electric Power Steering (EPS)
Hybrid Electric Vehicle (HEV) Applications
Heating Ventilation, and Air Conditioning (HVAC)
Industrial
Defibrillator
Heart Monitors
Heat Metering
Industrial HMI
Digital Stethoscope
Vital Signs Monitors
Powered Patient Beds
Air Conditioning (AC)
Home Health Gateway
Anesthesia Unit Monitor
Blood Glucose Management
Smart Power Socket and Light Switch
Continuous Positive Airway Pressure Machine (CPAP)
Mobile
Hearables
Wristband
Input Device (Mouse, Pen, Keyboard)
Smart City
Transport Ticketing
Automatic Vehicle Identification
Smart Home
Home Sensor
Robotic Appliance
Major Home Appliances
Home Security & Surveillance
Small and Medium Appliances
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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