

MICRON PC28F00AP30BFA
Manufacturer No:
PC28F00AP30BFA
Manufacturer:
Package:
64-TBGA
Description:
1.81.8/3.3V V Axcell™ 64 Pin Memory IC Axcell™ Series 28F00AP30 1 Gb kb 10mm mm 31mA mA 16b b
Quantity:
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PC28F00AP30BFA Information
MICRON PC28F00AP30BFA technical specifications, attributes, parameters and parts with similar specifications to MICRON PC28F00AP30BFA.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 64-TBGA
- Surface Mount
- YES
- Number of Pins
- 64
- Memory Types
- Non-Volatile
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- Axcell™
- Published
- 2009
- JESD-609 Code
- e1
- Type
- Parameter
- Pbfree Code
- yes
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 64
- ECCN Code
- 3A991.B.1.A
- Terminal Finish
- TIN SILVER COPPER
- Additional Feature
- BOTTOM BOOT
- HTS Code
- 8542.32.00.51
- Voltage - Supply
- 1.7V~2V
- Terminal Position
- BOTTOM
Download datasheets and manufacturer documentation for MICRON PC28F00AP30BFA.
Datasheets:
Product Description:
The Micron Technology Inc. PC28F00AP30BFA is a 1Gb, 64M x 16, 16-bit wide, asynchronous flash memory device that operates at a clock frequency of 52MHz. This Axcell? series device features a parallel interface and is packaged in a 64-TBGA package with a tray packaging option. The device has a nominal supply current of 31mA and operates within a temperature range of -40°C to 85°C.
Features:
- Memory Size: 1Gb (64M x 16)
- Memory Interface: Parallel
- Clock Frequency: 52MHz
- Operating Supply Voltage: 1.8V
- Power Supplies: 1.8V, 3.3V
- Radiation Hardening: No
- RoHS Status: ROHS3 Compliant
- Surface Mount: Yes
- Terminal Finish: TIN SILVER COPPER
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
Applications:
- Primary Applications:
- Embedded systems
- Industrial control systems
- Automotive systems
- Medical devices
- Secondary Applications:
- Consumer electronics
- Networking devices
- Storage devices
Alternative Parts:
- PC28F00AP30BFA
- PC28F00AP30BFAA
- PC28F00AP30BFAB
Embedded Modules:
- This component is used in various embedded modules, including:
- Microcontrollers
- Digital signal processors
- Field-programmable gate arrays
FAQs:
Q: What is the memory size of this device? A: The memory size of this device is 1Gb (64M x 16).
Q: What is the clock frequency of this device? A: The clock frequency of this device is 52MHz.
Q: What is the operating supply voltage of this device? A: The operating supply voltage of this device is 1.8V.
Q: Is this device RoHS compliant? A: Yes, this device is ROHS3 compliant.
Q: Is this device radiation hardened? A: No, this device is not radiation hardened.
Q: What is the packaging option for this device? A: The packaging option for this device is a tray.
Q: What is the terminal finish of this device? A: The terminal finish of this device is TIN SILVER COPPER.
Q: What is the terminal pitch of this device? A: The terminal pitch of this device is 1mm.
Q: What is the terminal position of this device? A: The terminal position of this device is BOTTOM.
Q: Is this device surface mountable? A: Yes, this device is surface mountable.
Q: What is the peak reflow temperature of this device? A: The peak reflow temperature of this device is 260°C.
Q: What is the time at peak reflow temperature of this device? A: The time at peak reflow temperature of this device is 30 seconds.
Q: Is this device Pb-free? A: Yes, this device is Pb-free.
Q: What is the MSL level of this device? A: The MSL level of this device is 3 (168 hours).
Q: What is the operating temperature range of this device? A: The operating temperature range of this device is -40°C to 85°C.
Q: What is the standby current of this device? A: The standby current of this device is 0.00024A.
Q: What is the supply voltage range of this device? A: The supply voltage range of this device is 1.7V to 2V.
Q: What is the word size of this device? A: The word size of this device is 16 bits.
Q: What is the write cycle time of this device? A: The write cycle time of this device is 100ns.
Q: Is this device obsolete? A: Yes, this device is obsolete.
Q: When was this device published? A: This device was published in 2009.
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