STMicroelectronics OIMMA8MBHP01701$
Manufacturer No:
OIMMA8MBHP01701$
Manufacturer:
STMicroelectronics
Package:
Description:
OIMMA8MBHP01701$.ARM® SecurCore® SC300 - Security Microcontroller IC 8-VDFN Exposed Pad
Quantity:
In Stock :5629
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
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PURCHASE
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
OIMMA8MBHP01701$ Information
STMicroelectronics OIMMA8MBHP01701$ technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics OIMMA8MBHP01701$.
- Type
- Parameter
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 105.0
- ECCN US
- 3A991.a.2
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- Grade
- Industrial
- Package Name
- VFDFPN 8 5X6 WETTABLE FLANK
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 105.0
- ECCN US
- 3A991.a.2
- Type
- Parameter
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- Grade
- Industrial
- Package Name
- VFDFPN 8 5X6 WETTABLE FLANK
Download datasheets and manufacturer documentation for STMicroelectronics OIMMA8MBHP01701$.
Data sheet:
The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.
It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.
The device can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.
- Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
- Bootstrap connectivity profile provided by a trusted partner
- Up to 7 connectivity profiles (depending on memory size)
- Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
- Network access applications supported: SIM / USIM / ISIM / CSIM
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP & HTTPS (including DNS)
- Multi-interfaces able to combine eSIM + eSE
- Hardware
- Product available on ST33G1M2M
- ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
- Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
- Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
- Serial peripheral interface (SPI), depending on packages
- Industrial qualification (JEDEC JESD47)
- Operating temperature: -40°C to +105°C
- Common Criteria EAL5+
- ECOPACK-compliant packages
- 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
- VFDFPN8 5 × 6 mm, wettable flank (MFF2)
- WLCSP11
- Security
- Symmetric cryptography DES / 3DES / AES
- Asymmetric cryptography RSA (up to 2048 bits)
- HTTPS remote management TLS v1.0, v1.1 and v1.2
- Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
- Authentication algorithm: MILENAGE, TUAK, CAVE
- Software standard compliance
- GSMA SGP.02 v3.2
- SIMalliance interoperable profile v2.1
- Java® Card v3.0.4 Classic
- GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
- ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
- Power saving features (PSM and eDRX) defined by ETSI release 13
- Certification
- GlobalPlatform®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
