MICRON MT29F8G08ABACAWP:C
Manufacturer No:
MT29F8G08ABACAWP:C
Manufacturer:
MICRON
Package:
48-TFSOP (0.724, 18.40mm Width)
Description:
Surface Mount Memory IC MT29F8G08 8 Gb kb 35mA mA 8b b
Quantity:
In Stock :3430
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Shipped from：HK Warehouse
Expected Shipping：Sat, Jun 13 - Sun, Jun 14, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
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3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
MT29F8G08ABACAWP:C Information
MICRON MT29F8G08ABACAWP:C technical specifications, attributes, parameters and parts with similar specifications to MICRON MT29F8G08ABACAWP:C.
- Type
- Parameter
- Factory Lead Time
- 4 Weeks
- Contact Plating
- Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 48-TFSOP (0.724, 18.40mm Width)
- Number of Pins
- 48
- Memory Types
- Non-Volatile
- Operating Temperature
- 0°C~70°C TA
- Packaging
- Tray
- Published
- 2009
- Type
- Parameter
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 48
- Voltage - Supply
- 2.7V~3.6V
- Terminal Position
- DUAL
- Terminal Pitch
- 0.5mm
- Base Part Number
- MT29F8G08
- Operating Supply Voltage
- 3.3V
- Memory Size
- 8Gb 1G x 8
- Nominal Supply Current
- 35mA
Download datasheets and manufacturer documentation for MICRON MT29F8G08ABACAWP:C.
Product Description:
The MT29F8G08ABACAWP:C is an 8Gb (1G x 8) parallel flash memory device from Micron Technology Inc. This surface-mountable IC is designed to provide high-density storage solutions for various applications. With an access time of 20ns, it offers fast data transfer rates. The device features a 31-bit address bus width, making it suitable for complex memory mapping requirements.
Features:
- High-density storage: 8Gb (1G x 8) memory size
- Fast access time: 20ns
- Parallel memory interface
- Non-volatile memory type
- 8-bit word size
- 4K sectors with 256K sector size
- Ready/busy signal for status monitoring
- RoHS3 compliant for environmental sustainability
Applications:
- Primary applications:
- Embedded systems
- Industrial control systems
- Automotive electronics
- Secondary applications:
- Consumer electronics
- Medical devices
- Aerospace and defense systems
Alternative Parts:
- MT29F8G08ABACAWP:B
- MT29F8G08ABACAWP:D
Embedded Modules:
- Various embedded systems and industrial control systems
FAQs:
Q: What is the access time of the MT29F8G08ABACAWP:C? A: The access time is 20ns.
Q: What is the memory size of the MT29F8G08ABACAWP:C? A: The memory size is 8Gb (1G x 8).
Q: What is the operating temperature range of the MT29F8G08ABACAWP:C? A: The operating temperature range is 0°C to 70°C.
Q: Is the MT29F8G08ABACAWP:C radiation hardened? A: No, it is not radiation hardened.
Q: What is the packaging type of the MT29F8G08ABACAWP:C? A: The packaging type is 48-TFSOP (0.724, 18.40mm Width) with tray packaging.
Q: Is the MT29F8G08ABACAWP:C RoHS compliant? A: Yes, it is RoHS3 compliant.
Q: What is the factory lead time for the MT29F8G08ABACAWP:C? A: The factory lead time is 4 weeks.
Q: When was the MT29F8G08ABACAWP:C published? A: The MT29F8G08ABACAWP:C was published in 2009.
Q: Is the MT29F8G08ABACAWP:C obsolete? A: Yes, the MT29F8G08ABACAWP:C is an obsolete part.
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