NXP MPC860TZQ66D4
Manufacturer No:
MPC860TZQ66D4
Manufacturer:
Package:
357-BBGA
Description:
1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA
Quantity:
User Guide
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
MPC860TZQ66D4 Information
NXP MPC860TZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP MPC860TZQ66D4.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Package / Case
- 357-BBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~95°C TA
- Packaging
- Tray
- Series
- MPC8xx
- Published
- 1995
- JESD-609 Code
- e0
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 357
- ECCN Code
- 3A991.A.2
- Terminal Finish
- Tin/Lead (Sn/Pb)
- HTS Code
- 8542.31.00.01
- Subcategory
- Microprocessors
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 245
- Supply Voltage
- 3.3V
Download datasheets and manufacturer documentation for NXP MPC860TZQ66D4.
Datasheets:
Environmental Information:
MPC860TZQ66D4 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR, RISC. The microprocessor can be searched for with MPC860 if you are looking for variants. In total, there are 357 terminations. When the voltage supply is 3.3V, the cpu microprocessor should be powered on and run. In terms of architecture, it is a 32-Bit system. It can supply a maximum current of 3.465V. Microprocessors is a typical embedded microprocessor. 32 is the width of the external data bus on this CPU. 50MHz is the microprocessor's clock frequency. According to its datasheet, this micro processor requires 3.3V power supplies.
MPC860TZQ66D4 Features
32-Bit Structure
MPC860TZQ66D4 Applications
There are a lot of NXP USA Inc.
MPC860TZQ66D4 Microprocessor applications.
- Consumer electronics products
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
MPC860TZQ66D4 Relevant information
The following parts are popular search parts in Integrated Circuits (ICs).
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