NXP MPC8533EVTALF
NXP MPC8533EVTALF

NXP MPC8533EVTALF

Manufacturer No:

MPC8533EVTALF

Manufacturer:

NXP

Package:

783-BBGA, FCBGA

Description:

1mm PowerPC e500v2 32-bit Microprocessor MPC85xx Series MPC8533 1V 783-BBGA, FCBGA

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

MPC8533EVTALF information

NXP MPC8533EVTALF technical specifications, attributes, parameters and parts with similar specifications to NXP MPC8533EVTALF.

  • Type
  • Parameter
  • Package / Case
  • 783-BBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • 0°C~90°C TA
  • Packaging
  • Tray
  • Series
  • MPC85xx
  • Published
  • 2006
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 783
  • ECCN Code
  • 3A001.A.3
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Supply Voltage
  • 1V
  • Terminal Pitch
  • 1mm
  • Base Part Number
  • MPC8533
  • JESD-30 Code
  • S-PBGA-B783
  • Supply Voltage-Max (Vsup)
  • 1.05V
  • Supply Voltage-Min (Vsup)
  • 0.95V
  • Speed
  • 667MHz
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR
  • Core Processor
  • PowerPC e500v2
  • Clock Frequency
  • 133MHz
  • Address Bus Width
  • 16
  • Boundary Scan
  • YES
  • Low Power Mode
  • YES
  • External Data Bus Width
  • 64
  • Format
  • FLOATING POINT
  • Integrated Cache
  • YES
  • Voltage - I/O
  • 1.8V 2.5V 3.3V
  • Ethernet
  • 10/100/1000Mbps (2)
  • Number of Cores/Bus Width
  • 1 Core 32-Bit
  • Graphics Acceleration
  • No
  • RAM Controllers
  • DDR, DDR2
  • Additional Interfaces
  • DUART, HSSI, I2C, PCI
  • Co-Processors/DSP
  • Security; SEC
  • Security Features
  • Cryptography, Random Number Generator
  • Length
  • 29mm
  • Height Seated (Max)
  • 2.8mm
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for NXP MPC8533EVTALF.

MPC8533EVTALF Description

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8533E. This device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell but are included for a more complete reference. These are not purely I/O buffer

design specifications.



MPC8533EVTALF Features

256-Kbyte L2 cache/SRAM

? Flexible configuration

? Full ECC support on the 64-bit boundary in both cache and SRAM modes

? Cache mode supports instruction caching, data caching, or both.

? External masters can force data to be allocated into the cache through programmed memory

ranges or special transaction types (stashing).

? 1, 2, or 4 ways can be configured for stashing only.

? Eight-way set-associative cache organization (32-byte cache lines)

? Supports locking the entire cache or selected lines. Individual line locks are set and cleared through

Book E instructions or externally mastered transactions.

? Global locking and flash clearing are done through writes to L2 configuration registers

? Instruction and data locks can be flash cleared separately.

? SRAM features include the following:

? I/O devices access SRAM regions by marking transactions as snoopable (global).

? Regions can reside at any aligned location in the memory map.

? Byte-accessible ECC is protected using read-modify-write transaction accesses for

smaller-than-cache-line accesses.

Address translation and mapping unit (ATMU)

? Eight local access windows define mapping within local 36-bit address space.

? Inbound and outbound ATMUs map to larger external address spaces.

? Three inbound windows plus a configuration window on PCI and PCI Express

? Four outbound windows plus default translation for PCI and PCI Express

DDR/DDR2 memory controller

? Programmable timing supporting DDR and DDR2 SDRAM

? 64-bit data interface




User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.