

NXP MPC755BPX300LE
Manufacturer No:
MPC755BPX300LE
Manufacturer:
Package:
360-BBGA, FCBGA
Description:
1.27mm PowerPC 32-bit Microprocessor MPC7xx Series MPC755 2V 360-BBGA, FCBGA
Quantity:
User Guide
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
MPC755BPX300LE Information
NXP MPC755BPX300LE technical specifications, attributes, parameters and parts with similar specifications to NXP MPC755BPX300LE.
- Type
- Parameter
- Package / Case
- 360-BBGA, FCBGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~105°C TA
- Packaging
- Tray
- Series
- MPC7xx
- Published
- 2001
- JESD-609 Code
- e0
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 360
- Type
- Parameter
- ECCN Code
- 3A991
- Terminal Finish
- Tin/Lead (Sn/Pb)
- Additional Feature
- ALSO REQUIRES 2.5V OR 3.3V SUPPLY
- HTS Code
- 8542.31.00.01
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 245
- Supply Voltage
- 2V
- Terminal Pitch
- 1.27mm
Download datasheets and manufacturer documentation for NXP MPC755BPX300LE.
MPC755BPX300LE Description
MPC755BPX300LE is manufactured by NXP Semiconductors. Its category belongs to Microprocessors - MPU. It is applied to many fields, like Automotive Hybrid, electric & powertrain systems Communications equipment Broadband fixed line access Enterprise systems Datacenter & enterprise computing. And the main parameters of this part are MPU PowerPC MPC7xx Processor RISC 64-Bit 0.22um 300MHz 2.5V/3.3V 360-Pin FCBGA Tray. Additionally, it is green and compliant with RoHS (Lead-free / RoHS Compliant).
MPC755BPX300LE Features
Branch processing un
Dispatch unit
Decode
Completion
Fixed point units (FXUs) that share 32 GPRs for integer opera
Floating-point unit and a 32-entry FPR
MPC755BPX300LE Applications
Automotive
Hybrid, electric & powertrain systems
Communications equipment
Broadband fixed line access
Enterprise systems
Datacenter & enterprise computing
MPC755BPX300LE Relevant information
The following parts are popular search parts in Integrated Circuits (ICs).
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Authenticity Guarantee
All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.
Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
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