NXP MPC555LFMVR40
Manufacturer No:
MPC555LFMVR40
Manufacturer:
Package:
272-BBGA
Description:
448KB 448K x 8 FLASH PowerPC 32-Bit Microcontroller MPC5xx Series MPC555 3.3V 272-BBGA
Quantity:
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MPC555LFMVR40 Information
NXP MPC555LFMVR40 technical specifications, attributes, parameters and parts with similar specifications to NXP MPC555LFMVR40.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 272-BBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~125°C TA
- Packaging
- Tray
- Series
- MPC5xx
- Published
- 2000
- JESD-609 Code
- e1
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 272
- ECCN Code
- 3A991.A.2
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Additional Feature
- ALSO REQUIRES 5V SUPPLY
- HTS Code
- 8542.31.00.01
- Technology
- HCMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 3.3V
Download datasheets and manufacturer documentation for NXP MPC555LFMVR40.
Datasheets:
Environmental Information:
PCN Design/Specification:
MPC555LFMVR40 Description
MPC555LFMVR40 is a type of microcontroller developed by NXP Semiconductors / Freescale. It is designed based on a PowerPC? core with a floating-point unit. MPC555LFMVR40 is able to deliver extensive system development support, fully static, low power operation, integrated double-precision floating-point unit, and precise exception model.
MPC555LFMVR40 Features
PowerPC? core with floating-point unit
26 Kbytes fast RAM and 6 Kbytes TPU microcode RAM
448 Kbytes Flash EEPROM with 5-V programming
5-V I/O system
Submicron HCMOS (CDR1) technology
272-pin plastic ball grid array (PBGA) packaging
MPC555LFMVR40 Applications
Motor control
Consumer electronics
Industrial control & automation
MPC555LFMVR40 Relevant information
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