NXP MCF5307AI66B
NXP MCF5307AI66B

NXP MCF5307AI66B

Manufacturer No:

MCF5307AI66B

Manufacturer:

NXP

Package:

208-BFQFP

Description:

ROMless Coldfire V3 32-Bit Microcontroller MCF530x Series MCF5307 3.3V 208-BFQFP

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

MCF5307AI66B information

NXP MCF5307AI66B technical specifications, attributes, parameters and parts with similar specifications to NXP MCF5307AI66B.

  • Type
  • Parameter
  • Factory Lead Time
  • 10 Weeks
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 208-BFQFP
  • Surface Mount
  • YES
  • Operating Temperature
  • 0°C~70°C TA
  • Packaging
  • Tray
  • Series
  • MCF530x
  • Published
  • 1999
  • JESD-609 Code
  • e3
  • Part Status
  • Not For New Designs
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 208
  • ECCN Code
  • 3A991.A.2
  • Terminal Finish
  • Matte Tin (Sn)
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • QUAD
  • Terminal Form
  • GULL WING
  • Peak Reflow Temperature (Cel)
  • 250
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 0.5mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • MCF5307
  • JESD-30 Code
  • S-PQFP-G208
  • Supply Voltage-Max (Vsup)
  • 3.6V
  • Supply Voltage-Min (Vsup)
  • 3V
  • Oscillator Type
  • External
  • Number of I/O
  • 16
  • Speed
  • 66MHz
  • RAM Size
  • 4K x 8
  • Voltage - Supply (Vcc/Vdd)
  • 3V~3.6V
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR, RISC
  • Core Processor
  • Coldfire V3
  • Peripherals
  • DMA, POR, WDT
  • Clock Frequency
  • 33.33MHz
  • Program Memory Type
  • ROMless
  • Core Size
  • 32-Bit
  • Connectivity
  • EBI/EMI, I2C, UART/USART
  • Bit Size
  • 32
  • Address Bus Width
  • 32
  • Boundary Scan
  • YES
  • Low Power Mode
  • YES
  • External Data Bus Width
  • 32
  • Format
  • FIXED POINT
  • Integrated Cache
  • YES
  • Length
  • 28mm
  • Height Seated (Max)
  • 4.1mm

Download datasheets and manufacturer documentation for NXP MCF5307AI66B.

Datasheets:

Environmental Information:

MCF5307AI66B Description


The NXP MCF5307AI66B  is a microprocessor integrated microprocessor that combines a V3 ColdFire processor core.



MCF5307AI66B Features


  • ColdFire processor core

  • 8-Kbyte unified cache

  • 4-Kbyte on-chip SRAM

  • Integer/fractional multiply-accumulate (MAC) unit

  • Divide unit

  • System debug interface

  • DRAM controller for synchronous and asynchronous DRAM

  • Four-channel DMA controller

  • Two general-purpose timers

  • Two UARTs

  • I2C? interface

  • Parallel I/O interface

  • System integration module (SIM)



MCF5307AI66B Applications


  • DMAs

  • Various DRAM controller interfaces

  • On-chip memories


User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

MCF5307AI66B Relevant information

The following parts are popular search parts in Integrated Circuits (ICs).