NXP MC9S08DZ128CLL

Manufacturer No:

MC9S08DZ128CLL

Manufacturer:

NXP

Package:

100-LQFP

Description:

128KB 128K x 8 FLASH 8-Bit Microcontroller S08 Series MC9S08DZ128 3V 100-LQFP

Quantity:

Delivery:

Payment:

In Stock :Available

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MC9S08DZ128CLL information

NXP MC9S08DZ128CLL technical specifications, attributes, parameters and parts with similar specifications to NXP MC9S08DZ128CLL.

Type
Parameter

Factory Lead Time
10 Weeks

Mounting Type
Surface Mount

Package / Case
100-LQFP

Surface Mount
YES

Operating Temperature
-40°C~85°C TA

Packaging
Tray

Series
S08

Published
2002

JESD-609 Code
e3

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
100

ECCN Code
3A991.A.2

Terminal Finish
Matte Tin (Sn)

HTS Code
8542.31.00.01

Subcategory
Microcontrollers

Technology
CMOS

Terminal Position
QUAD

Terminal Form
GULL WING

Peak Reflow Temperature (Cel)
260

Supply Voltage
3V

Terminal Pitch
0.5mm

Time@Peak Reflow Temperature-Max (s)
40

Base Part Number
MC9S08DZ128

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
5.5V

Power Supplies
3/5V

Supply Voltage-Min (Vsup)
2.7V

Oscillator Type
External

Number of I/O
87

Speed
40MHz

RAM Size
8K x 8

Voltage - Supply (Vcc/Vdd)
2.7V~5.5V

uPs/uCs/Peripheral ICs Type
MICROCONTROLLER

Peripherals
LVD, POR, PWM, WDT

Clock Frequency
38.4MHz

Program Memory Type
FLASH

Core Size
8-Bit

Program Memory Size
128KB 128K x 8

Connectivity
CANbus, I2C, LINbus, SCI, SPI

Supply Current-Max
24mA

Bit Size
8

Data Converter
A/D 24x12b

Has ADC
YES

DMA Channels
NO

PWM Channels
YES

Address Bus Width
16

Download datasheets and manufacturer documentation for NXP MC9S08DZ128CLL.

Datasheets:

nxpusainc-mc9s08dz128clh-datasheets-5185.pdf

Environmental Information:

nxpusainc-tef6657hnv102k-environmentalinformation-9391.pdf

MC9S08DZ128CLL Description

Because of the devices in the S08D family's interoperability with one another's pins, peripherals, and tools, the S08D family gives designers scalability and migration options. This fully integrated next-generation MC9S08DZ128CLL MCU is full of features that boost performance while reducing costs, board space, power consumption, and development time.

MC9S08DZ128CLL Features

S08 CPU
40 MHz core speed, 20 MHz bus speed on S08 CPU
HC08 instruction set with added BGND instruction
On-Chip Memory
Up to 128 KB flash read/program/erase over full operating voltage and temperature
Up to 2 KB EEPROM in-circuit programmable memory; 8-byte single-page or 4-byte dualpage erase sector; program and erase while executing flash; erase abort
Up to 8 KB RAM (16:1 flash/RAM, ratio better than competition)
Power Saving Modes
Two very low-power stop modes
Very low-power, real-time interrupt for use in run, wait and stop modes
Clock Source Options
Oscillator (XOSC)?Loop-control Pierce oscillator; crystal or ceramic resonator range of 31.25 kHz?38.4 kHz or 1 MHz?16 MHz
Multi-purpose clock generator (MCG)?PLL and FLL modes; internal reference clock with trim adjustment; external reference with oscillator/resonator options
System Protection
Watchdog computer operating properly (COP) reset with option to run from dedicated 1 kHz internal clock source or bus clock
Low-voltage detection with reset or interrupt; selectable trip points
Illegal opcode detection with reset
Illegal address detection with reset
Flash block protect
EEPROM block protect
Development Support
Single-wire background debug (BDM) interface
On-chip, in-circuit emulation (ICE) with real-time bus capture
Input/Output
87 general-purpose I/O pins and one input-only pin
32 interrupt pins with selectable polarity on each pin
Hysteresis and configurable pull-up device on all input pins
Configurable slew rate and device strength on all output pins
Package Options
100 LQFP 14 x 14 mm
64-pin low-profile quad flat pack (LQFP)?10 x 10 mm
48-pin LQFP?7 x 7 mm
32-pin LQFP?7 x 7 mm
Miscellaneous
EMC performance
Wide operating voltage range: 2.7V?5.5V
Background Debugging System
On-chip BDM
Package
Pin-compatible with SH, QG family

MC9S08DZ128CLL Applications

Industrial
Enterprise systems
Communications equipment

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.