NXP MC56F8365MFGE
Manufacturer No:
MC56F8365MFGE
Manufacturer:
Package:
128-LQFP
Description:
512KB 256K x 16 FLASH 56800E 16-Bit Microcontroller 56F8xxx Series MC56F8365 2.5V 128-LQFP
Quantity:
Delivery:
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In Stock :Available
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MC56F8365MFGE information
NXP MC56F8365MFGE technical specifications, attributes, parameters and parts with similar specifications to NXP MC56F8365MFGE.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 128-LQFP
- Surface Mount
- YES
- Operating Temperature
- -40°C~125°C TA
- Packaging
- Tray
- Series
- 56F8xxx
- Published
- 1998
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 128
- ECCN Code
- 3A991.A.2
- Terminal Finish
- Matte Tin (Sn)
- Additional Feature
- ALSO REQUIRES 3.3V SUPPLY
- HTS Code
- 8542.31.00.01
- Subcategory
- Microcontrollers
- Technology
- CMOS
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 2.5V
- Terminal Pitch
- 0.5mm
- Time@Peak Reflow Temperature-Max (s)
- 40
- JESD-30 Code
- R-PQFP-G128
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 2.75V
- Power Supplies
- 2.53.3V
- Supply Voltage-Min (Vsup)
- 2.25V
- Oscillator Type
- External
- Number of I/O
- 49
- Speed
- 60MHz
- RAM Size
- 18K x 16
- Voltage - Supply (Vcc/Vdd)
- 2.25V~3.6V
- uPs/uCs/Peripheral ICs Type
- DIGITAL SIGNAL PROCESSOR, OTHER
- Core Processor
- 56800E
- Peripherals
- POR, PWM, Temp Sensor, WDT
- Clock Frequency
- 120MHz
- Program Memory Type
- FLASH
- Core Size
- 16-Bit
- Program Memory Size
- 512KB 256K x 16
- Connectivity
- CANbus, EBI/EMI, SCI, SPI
- Bit Size
- 16
- Data Converter
- A/D 16x12b
- Address Bus Width
- 11
- ROM (words)
- 524288
- Boundary Scan
- YES
Download datasheets and manufacturer documentation for NXP MC56F8365MFGE.
Datasheets:
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PCN Packaging:
MC56F8365MFGE Description
MC56F8365MFGE emerges as a digital signal controller provided by NXP Semiconductors / Freescale. The digital signal processing is combined with microcontroller functionalities on a single chip, with a flexible set of peripherals. Due to on-chip integration and ease of implementation, the development is improved, the component count is lowered, and the system cost is reduced. MC56F8365MFGE digital signal controller is able to implify designs while promoting compliance with safety regulations.
MC56F8365MFGE Features
On-chip memory includes high-speed volatile and nonvolatile components
Access up to 4 MB of off-chip program and 32 MB of data memory
Up to 60 MIPS at 60 MHz execution frequency
Chip select logic for glueless interface to ROM and SRAM
JTAG/EOnCE for unobtrusive real-time debugging
Up to two serial peripheral interfaces (SPIs)
MC56F8365MFGE Applications
Brushless DC Motor (BLDC) Control
Permanent Magnet Synchronous Motor (PMSM)
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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