Microchip M2S090S-1FG484I
Manufacturer No:
M2S090S-1FG484I
Manufacturer:
Microchip
Package:
484-BGA
Description:
-40°C~100°C TJ M2S090S System On Chip SmartFusion®2 Series 267 I/O
Quantity:
In Stock :3704
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Shipped from：HK Warehouse
Expected Shipping：Thu, Jun 4 - Fri, Jun 5, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
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Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
M2S090S-1FG484I Information
Microchip M2S090S-1FG484I technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S090S-1FG484I.
- Type
- Parameter
- Package / Case
- 484-BGA
- Supplier Device Package
- 484-FPBGA (23x23)
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- SmartFusion®2
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 100°C
- Min Operating Temperature
- -40°C
- Frequency
- 166MHz
- Type
- Parameter
- Base Part Number
- M2S090S
- Interface
- CAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O
- 267
- Speed
- 166MHz
- RAM Size
- 64KB
- Core Processor
- ARM® Cortex®-M3
- Peripherals
- DDR, PCIe, SERDES
- Connectivity
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Architecture
- MCU, FPGA
- Core Architecture
- ARM
Download datasheets and manufacturer documentation for Microchip M2S090S-1FG484I.
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os are included in this SoC part.A 512KB flash can be seen on it.Search M2S090S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090S-1FG484I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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12.28 M
Listed Part Number
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In-stock SKU
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