Microchip M2S060TS-1FGG676
Manufacturer No:
M2S060TS-1FGG676
Manufacturer:
Microchip
Package:
676-BGA
Description:
SmartFusion2 SoC FPGAs Offer More Resources in Low Density Devices with The Lowest Power, Proven Security and Exceptional Reliability.
Quantity:
In Stock :1790
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Thu, Jun 11 - Fri, Jun 12, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Quality Assurance
Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.
User Guide
Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.
PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
M2S060TS-1FGG676 Information
Microchip M2S060TS-1FGG676 technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S060TS-1FGG676.
- Type
- Parameter
- CAN
- 1
- DDRController
- LPDDR/DDR2/3
- Ethernet
- 10/100/1000 MAC
- Total RAM Kbit (kilobit)
- 1314
- Max. GPIO (3.3V) Max
- NA
- Max. HSIO (1.89V) Max
- NA
- Hard CPU
- Cortex-M3
- I2C
- 2
- LogicElements(K)
- 56.5
- MMC
- No
- Type
- Parameter
- Math Blocks 18x18
- 72
- PCIe Lanes
- 2
- Product Type
- SmartFusion2
- QSPI
- No
- SPI
- 2
- Temp Max °C (degrees Celsius)
- 125
- Temp Min °C (degrees Celsius)
- -55
- UART
- 2
- USB
- 1 HS 2.0 OTG
- SERDES lanes
- 4
Download datasheets and manufacturer documentation for Microchip M2S060TS-1FGG676.
User Guide:
Supporting Collateral:
White Paper:
Data Sheets:
Configuration Guide:
Errata:
Board Design Files:
Application Notes:
These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
• PCIe Gen2 support
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• 70mW per 5G SERDES (PCIe Gen2)
• Proven Security
• Protection from Overbuilding and Cloning
• Secure Boot for FPGA & Processors
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
• PCIe Gen2 support
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• 70mW per 5G SERDES (PCIe Gen2)
• Proven Security
• Protection from Overbuilding and Cloning
• Secure Boot for FPGA & Processors
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
- Microcontroller Subsystem
- Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA
- 1.25 DMIPS/MHz
- 256 KB embedded nonvolatile memory (eNVM)
- Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
- USB 2.0 high speed on-the-go (OTG) controller
- 2.0B-compliant CAN controller
- 64 KB embedded SRAM (eSRAM)
- Two SPI ports, two I2C ports, and multi-mode UARTs
- FPGA Fabric
- 56.5K logic elements
- 72 Math blocks (18x18)
- AES256, SHA256, RNG
- ECC, PUF
- 6 PLLs and CCCs
- 1314K bits RAM
- 1 DDR Controller - LPDDR/DDR2/3
- 4 SERDES Lanes
- 2 PCIe End Points
- Offers design security
- Temperature - Commercial, Industrial, Automotive (T2), Military
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12.28 M
Listed Part Number
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