Microchip M2S060-1FGG676I
Manufacturer No:
M2S060-1FGG676I
Manufacturer:
Microchip
Package:
676-BGA
Description:
SmartFusion2 SoC FPGAs Offer More Resources in Low Density Devices with The Lowest Power, Proven Security and Exceptional Reliability.
Quantity:
In Stock :1878
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Wed, Jun 3 - Thu, Jun 4, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
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PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
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Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
M2S060-1FGG676I Information
Microchip M2S060-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S060-1FGG676I.
- Type
- Parameter
- CAN
- 1
- DDRController
- LPDDR/DDR2/3
- Ethernet
- 10/100/1000 MAC
- Total RAM Kbit (kilobit)
- 1314
- Max. GPIO (3.3V) Max
- NA
- Max. HSIO (1.89V) Max
- NA
- Hard CPU
- Cortex-M3
- I2C
- 2
- LogicElements(K)
- 56.5
- MMC
- No
- Type
- Parameter
- Math Blocks 18x18
- 72
- PCIe Lanes
- 2
- Product Type
- SmartFusion2
- QSPI
- No
- SERDES Speed & Lanes
- No
- SPI
- 2
- Temp Max °C (degrees Celsius)
- 100
- Temp Min °C (degrees Celsius)
- -40
- UART
- 2
- USB
- 1 HS 2.0 OTG
Download datasheets and manufacturer documentation for Microchip M2S060-1FGG676I.
Configuration Guide:
Brochures:
Data Sheets:
Product Brief:
User Guide:
Errata:
Board Design Files:
White Paper:
Application Notes:
Supporting Collateral:
These flash FPGA devices are ideal for general purpose functions such as bridging functions, input/output (I/O) expansion and conversion, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• Proven Security
• Protection from Overbuilding and Cloning
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• Proven Security
• Protection from Overbuilding and Cloning
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
- Microcontroller Subsystem
- Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA
- 1.25 DMIPS/MHz
- 256 KB embedded nonvolatile memory (eNVM)
- Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
- USB 2.0 high speed on-the-go (OTG) controller
- 2.0B-compliant CAN controller
- 64 KB embedded SRAM (eSRAM)
- Two SPI ports, two I2C ports, and multi-mode UARTs
- FPGA Fabric
- 56.5K logic elements
- 72 Math blocks (18x18)
- 6 PLLs and CCCs
- 1314K bits RAM
- DDR Controller - LPDDR/DDR2/3
- Offers design security
- Temperature - Commercial, Industrial
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12.28 M
Listed Part Number
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In-stock SKU
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