Microchip M2S010T-VFG256I
Manufacturer No:
M2S010T-VFG256I
Manufacturer:
Microchip
Package:
256-LBGA
Description:
SmartFusion2 SoC FPGAs Offer More Resources in Low Density Devices with The Lowest Power, Proven Security and Exceptional Reliability.
Quantity:
In Stock :6073
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
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Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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User Guide
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PURCHASE
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Step2：Desiccant Protection
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Step4：Individual Package
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SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
M2S010T-VFG256I Information
Microchip M2S010T-VFG256I technical specifications, attributes, parameters and parts with similar specifications to Microchip M2S010T-VFG256I.
- Type
- Parameter
- CAN
- 1
- DDRController
- LPDDR/DDR2/3
- Ethernet
- 10/100/1000 MAC
- Total RAM Kbit (kilobit)
- 400
- Max. GPIO (3.3V) Max
- NA
- Max. HSIO (1.89V) Max
- NA
- Hard CPU
- Cortex-M3
- I2C
- 2
- LogicElements(K)
- 12
- MMC
- No
- Type
- Parameter
- Math Blocks 18x18
- 22
- PCIe Lanes
- 1
- Product Type
- SmartFusion2
- QSPI
- No
- SPI
- 2
- Temp Max °C (degrees Celsius)
- 125
- Temp Min °C (degrees Celsius)
- -55
- UART
- 2
- USB
- 1 HS 2.0 OTG
- SERDES lanes
- 4
Download datasheets and manufacturer documentation for Microchip M2S010T-VFG256I.
Application Notes:
User Guide:
Supporting Collateral:
White Paper:
Brochures:
Errata:
Product Brief:
Configuration Guide:
Data Sheets:
These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
• PCIe Gen2 support
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• 70mW per 5G SERDES (PCIe Gen2)
• Proven Security
• Protection from Overbuilding and Cloning
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
• PCIe Gen2 support
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• 70mW per 5G SERDES (PCIe Gen2)
• Proven Security
• Protection from Overbuilding and Cloning
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems
- Microcontroller Subsystem
- Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA
- 1.25 DMIPS/MHz
- 256 KB embedded nonvolatile memory (eNVM)
- Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
- USB 2.0 high speed on-the-go (OTG) controller
- 2.0B-compliant CAN controller
- 64 KB embedded SRAM (eSRAM)
- Two SPI ports, two I2C ports, and multi-mode UARTs
- FPGA Fabric
- 12K logic elements
- 22 Math blocks (18x18)
- 2 PLLs and CCCs
- 400K bits RAM
- DDR Controller - LPDDR/DDR2/3
- 4 SERDES Lanes
- 1 PCIe End Points
- Offers design security
- Temperature - Commercial, Industrial, Military
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