M1AFS1500-1FGG676-Microchip-Price, Stock & Datasheet

M1AFS1500-1FGG676 Overview

The package that contains this software is called 676-BGA. There are 252 I/Os for better data transfer. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.425V~1.575V battery. There are many types of FPGAs in the Fusion® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 276480. If you are looking for related parts, you can use the base part number M1AFS1500 as a starting point. For the program to work properly, the RAM si33.8kBe of this FPGA module must reach 33.8kB GB in order to ensure normal operation. In this case, 676 pins are used in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.5V supply voltage. When this module is operated at its maximum operating temperature, it reaches 70°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 1500000 gates. In order to store and transfer data, a total of 38400 registers are used. This device is capable of supporting a maximum supply voltage of 1.575V. Using 1.425V as the minimum supply voltage, fpga semiconductor can operate. As fast as 1.28205GHz can be reached with this FPGA. The supplier of the device package is 676-FBGA (27x27).