STMicroelectronics LSM6DSV320XTR
Manufacturer No:
LSM6DSV320XTR
Manufacturer:
STMicroelectronics
Package:
Description:
6-axis IMU (inertial measurement unit) with dual accelerometer up to 320 g and embedded AI for activity tracking and high-impact sensing
Quantity:
In Stock :2404
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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LSM6DSV320XTR Information
STMicroelectronics LSM6DSV320XTR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics LSM6DSV320XTR.
- Type
- Parameter
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.86 mm
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- Type
- Parameter
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.86 mm
Download datasheets and manufacturer documentation for STMicroelectronics LSM6DSV320XTR.
Data sheet:
Material Declaration:
The LSM6DSV320X is a high-end, low-noise, low-power, small IMU, featuring a 3-axis digital low-g accelerometer at 16 g, a 3-axis digital high-g accelerometer at 320 g, and a 3-axis digital gyroscope, which offers the best IMU sensor with an architecture for processing acceleration and angular rate data on four separate channels (user interface, OIS, EIS, and high-g accelerometer data). This IMU enables a new range of applications targeting emergency calls, fall/drop reconstruction, intense movement tracking, concussion monitoring, and so forth.
The device enables edge AI computing, leveraging a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for personal electronics and IoT applications.
The LSM6DSV320X features adaptive self-configuration (ASC) to optimize power consumption. The sensor can automatically adjust its settings in real time upon detecting a specific motion pattern or signal from the MLC, without intervention from the host processor. The digital circuitry also includes ST’s sensor fusion low-power (SFLP) technology for spatial orientation.
The device embeds a dedicated accelerometer sensor with an independent channel and filtering for high-g acceleration detection that perfectly matches shock requirements for sports, concussion detection, shock detection, and a full range of car crash detection applications.
- Quad-channel architecture for UI, EIS, OIS, and high-g data processing
- Smart, always-aware experience for system power optimization
- Dual accelerometer channels
- Low-g channel ±2/±4/±8/±16 g full scale
- High-g channel ±32/±64/±128/±256/±320 g full scale
- Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Auxiliary SPI & MIPI I3C® v1.1 for OIS data output for gyroscope and accelerometer
- Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power (SFLP) algorithm
- OIS configurable from the auxiliary or primary interface
- EIS dedicated channel on primary interface with dedicated filtering
- Advanced pedometer, step detector, and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock
- Smart FIFO up to 4.5 KB
- Embedded temperature sensor
- Independent I/O supply
- I²C voltage range: 1.62 V to 3.6 V
- SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V
- Supply current
- 6-axis configuration @ 0.67 mA in combo high-performance mode
- 9-axis configuration @ 0.80 mA in combo high-performance mode
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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