STMicroelectronics LSM6DSV16BTR
Manufacturer No:
LSM6DSV16BTR
Manufacturer:
STMicroelectronics
Package:
Description:
INEMO INERTIAL MODULE: 3D ACCELE.Accelerometer, Gyroscope, Temperature, 6 Axis Sensor I2C, I3C, SPI Output
Quantity:
In Stock :3847
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Shipped from：HK Warehouse
Expected Shipping：Fri, May 29 - Sat, May 30, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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LSM6DSV16BTR Information
STMicroelectronics LSM6DSV16BTR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics LSM6DSV16BTR.
- Type
- Parameter
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.74 mm
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 85.0
- Type
- Parameter
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.74 mm
Download datasheets and manufacturer documentation for STMicroelectronics LSM6DSV16BTR.
Data sheet:
Material Declaration:
The LSM6DSV16B is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with dual channels for processing acceleration and angular rate sensing data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction on separate channels with dedicated configuration, processing, and filtering.
The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.
The LSM6DSV16B embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), and adaptive self-configuration (ASC).
The LSM6DSV16B integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).
- Dual channels for motion tracking and bone conduction
- Power consumption: 0.95 mA in combo high-performance mode
- “Always-on experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 KB
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- 3-axis audio accelerometer with flat and wide bandwidth > 1 kHz and low noise 20 μg /√Hz
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- TDM slave interface
- Advanced pedometer, step detector, and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click
- Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power algorithm
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Compact footprint: 2.5 mm x 3 mm x 0.71 mm
- ECOPACK and RoHS compliant
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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