

NXP LPC2470FET208,551
Manufacturer No:
LPC2470FET208,551
Manufacturer:
Package:
208-TFBGA
Description:
ROMless ARM7® 16/32-Bit Microcontroller LPC2400 Series LPC2470 3.3V 208-TFBGA
Quantity:
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LPC2470FET208,551 information
NXP LPC2470FET208,551 technical specifications, attributes, parameters and parts with similar specifications to NXP LPC2470FET208,551.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 208-TFBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- LPC2400
- Published
- 2003
- JESD-609 Code
- e1
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 2 (1 Year)
- Number of Terminations
- 208
- ECCN Code
- EAR99
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.31.00.01
- Subcategory
- Microcontrollers
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 3.3V
- Terminal Pitch
- 0.8mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Base Part Number
- LPC2470
- JESD-30 Code
- S-PBGA-B208
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 3.6V
- Power Supplies
- 3.3V
- Supply Voltage-Min (Vsup)
- 3V
- Oscillator Type
- Internal
- Number of I/O
- 160
- Speed
- 72MHz
- RAM Size
- 98K x 8
- Voltage - Supply (Vcc/Vdd)
- 3V~3.6V
- uPs/uCs/Peripheral ICs Type
- MICROCONTROLLER, RISC
- Core Processor
- ARM7®
- Peripherals
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Clock Frequency
- 24MHz
- Program Memory Type
- ROMless
- Core Size
- 16/32-Bit
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
- Bit Size
- 32
- Data Converter
- A/D 8x10b; D/A 1x10b
- Has ADC
- YES
- DMA Channels
- YES
- PWM Channels
- YES
- DAC Channels
- YES
Download datasheets and manufacturer documentation for NXP LPC2470FET208,551.
Datasheets:
Environmental Information:
LPC2470FET208,551 Overview
The package is 208-TFBGA-shaped. There are 160 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16/32-Bit core architecture. The type of program memory it uses is ROMless. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the LPC2400 series of electrical components. A ARM7® Core Processor is at the core of this Microcontroller. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 208 has 208 terminations. 32-bits are used for its size. IC Chip has 3.3V volt supply outputs. With YES DMA channels, Microcontroller chip can handle large data transfers. Using the base part number LPC2470, you will be able to find alternatives for the part. Devices work in YES PWM channels. The pin count is 208. As far as its frequency goes, it operates according to a 24MHz clock.
LPC2470FET208,551 Features
208-TFBGA package
Mounting type of Surface Mount
Microcontrollers subcategory
LPC2470FET208,551 Applications
There are a lot of NXP USA Inc.
LPC2470FET208,551 Microcontroller applications.
- Instrument control
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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