LPC1768FBD100,551

NXP USA Inc.
Manufacturer No. :
LPC1768FBD100,551
RoHS Status :
ROHS3 Compliant
Description :
512KB 512K x 8 FLASH ARM® Cortex®-M3 32-Bit Microcontroller LPC17xx Series LPC1768 3.3V 100-LQFP
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Product Attribute
NXP USA Inc. LPC1768FBD100,551 technical specifications, attributes, parameters
Part Status
Discontinued
Terminal Finish
Tin (Sn)
Supply Voltage-Max (Vsup)
3.6V
Program Memory Type
FLASH
Height Seated (Max)
1.6mm
Has ADC
YES
RoHS Status
ROHS3 Compliant
Number of I/O
70
Core Processor
ARM® Cortex®-M3
Package / Case
100-LQFP
ECCN Code
EAR99
Pin Count
100
ROM (words)
524288
Terminal Form
GULL WING
Base Part Number
LPC1768
Peak Reflow Temperature (Cel)
260
Connectivity
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
PWM Channels
YES
JESD-609 Code
e3
Supply Voltage
3.3V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Bit Size
32
Mounting Type
Surface Mount
Additional Feature
PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE
Operating Temperature
-40°C~85°C TA
DAC Channels
YES
JESD-30 Code
S-PQFP-G100
Oscillator Type
Internal
Supply Voltage-Min (Vsup)
2.4V
Width
14mm
Series
LPC17xx
CPU Family
ARM7
Technology
CMOS
Terminal Pitch
0.5mm
Qualification Status
Not Qualified
Number of Terminations
100
On Chip Program ROM Width
8
Speed
100MHz
Core Size
32-Bit
Peripherals
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Data Converter
A/D 8x12b; D/A 1x10b
Published
2010
Program Memory Size
512KB 512K x 8
Voltage - Supply (Vcc/Vdd)
2.4V~3.6V
Terminal Position
QUAD
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s)
30
RAM Size
64K x 8
Power Supplies
2.5/3.33/3.3V
Factory Lead Time
12 Weeks
HTS Code
8542.31.00.01
Packaging
Tray
DMA Channels
YES
Surface Mount
YES
Length
14mm
Subcategory
Microcontrollers
Clock Frequency
25MHz
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