NXP LPC1317FBD48,551
Manufacturer No:
LPC1317FBD48,551
Manufacturer:
Package:
48-LQFP
Description:
64KB 64K x 8 FLASH ARM® Cortex®-M3 32-Bit Microcontroller LPC13xx Series LPC1317 3.3V 48-LQFP
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LPC1317FBD48,551 information
NXP LPC1317FBD48,551 technical specifications, attributes, parameters and parts with similar specifications to NXP LPC1317FBD48,551.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 48-LQFP
- Surface Mount
- YES
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- LPC13xx
- Published
- 2010
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 48
- Terminal Finish
- Tin (Sn)
- Subcategory
- Microcontrollers
- Technology
- CMOS
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 3.3V
- Terminal Pitch
- 0.5mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Base Part Number
- LPC1317
- Pin Count
- 48
- JESD-30 Code
- S-PQFP-G48
- Supply Voltage-Max (Vsup)
- 3.6V
- Power Supplies
- 3.3V
- Supply Voltage-Min (Vsup)
- 2V
- Oscillator Type
- Internal
- Number of I/O
- 40
- Speed
- 72MHz
- RAM Size
- 10K x 8
- Voltage - Supply (Vcc/Vdd)
- 2V~3.6V
- uPs/uCs/Peripheral ICs Type
- MICROCONTROLLER, RISC
- Core Processor
- ARM® Cortex®-M3
- Peripherals
- Brown-out Detect/Reset, POR, WDT
- Clock Frequency
- 25MHz
- Program Memory Type
- FLASH
- Core Size
- 32-Bit
- Program Memory Size
- 64KB 64K x 8
- Connectivity
- I2C, Microwire, SPI, SSI, SSP, UART/USART
- Bit Size
- 32
- Data Converter
- A/D 8x12b
- Has ADC
- YES
- DMA Channels
- NO
- PWM Channels
- NO
- DAC Channels
- NO
- ROM (words)
- 65536
Download datasheets and manufacturer documentation for NXP LPC1317FBD48,551.
Datasheets:
Environmental Information:
LPC1317FBD48,551 Overview
Packaged in a 48-LQFP format, this MCU is available in a compact size. This Microcontroller has 40 I/Os. The Mounting Type of the Microcontroller is Surface Mount. The MCU is based on the 32-Bit core. The type of program memory it uses is FLASH. The temperature range of this Microcontroller is within the range of -40°C~85°C TA. The LPC13xx series includes this electrical component. 64KB 64K x 8 is the size of its program memory. There is a ARM® Cortex®-M3 Core Processor inside MCU that provides this device with its power. MICROCONTROLLER, RISC uPs, uCs, and peripheral ICs make up the Microcontroller. 48 is the number of terminations on the IC chip that are present. 32-bits are used for its size. IC Chip has 3.3V volt supply outputs. Currently, MCU chip has NO DMA channels. You can find alternatives through the base part number LPC1317. This MCU Chip uses NO PWM channels to operate. A total of 48 pins are present. There is an embedded the CORTEX-M3 CPU family inside the device, which makes it a powerful device. It's got a 25MHz clock.
LPC1317FBD48,551 Features
48-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
LPC1317FBD48,551 Applications
There are a lot of NXP USA Inc. LPC1317FBD48,551 Microcontroller applications.
Guidance-GPS
Fax machines
Mobile computers
Automatic control
Nintendo
DDC control
Playstation
Embedded gateways
Equipment control
Walkie talkies
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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