

NXP LPC1114FHN33/301,5
Manufacturer No:
LPC1114FHN33/301,5
Manufacturer:
Package:
32-VQFN Exposed Pad
Description:
32KB 32K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller LPC1100 Series LPC1114 3.3V 32-VQFN Exposed Pad
Quantity:
Delivery:




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In Stock :Available
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LPC1114FHN33/301,5 information
NXP LPC1114FHN33/301,5 technical specifications, attributes, parameters and parts with similar specifications to NXP LPC1114FHN33/301,5.
- Type
 - Parameter
 
- Factory Lead Time
 - 16 Weeks
 
- Mounting Type
 - Surface Mount
 
- Package / Case
 - 32-VQFN Exposed Pad
 
- Surface Mount
 - YES
 
- Data Converters
 - A/D 8x10b
 
- Number of I/Os
 - 28
 
- Operating Temperature
 - -40°C~85°C TA
 
- Packaging
 - Tray
 
- Series
 - LPC1100
 
- Published
 - 2010
 
- JESD-609 Code
 - e4
 
- Part Status
 - Active
 
- Moisture Sensitivity Level (MSL)
 - 3 (168 Hours)
 
- Number of Terminations
 - 33
 
- ECCN Code
 - EAR99
 
- Terminal Finish
 - Nickel/Palladium/Gold (Ni/Pd/Au)
 
- HTS Code
 - 8542.31.00.01
 
- Terminal Position
 - QUAD
 
- Terminal Form
 - NO LEAD
 
- Peak Reflow Temperature (Cel)
 - 260
 
- Supply Voltage
 - 3.3V
 
- Terminal Pitch
 - 0.65mm
 
- Time@Peak Reflow Temperature-Max (s)
 - 30
 
- Base Part Number
 - LPC1114
 
- JESD-30 Code
 - S-PQCC-N33
 
- Supply Voltage-Max (Vsup)
 - 3.6V
 
- Supply Voltage-Min (Vsup)
 - 1.8V
 
- Oscillator Type
 - Internal
 
- Speed
 - 50MHz
 
- RAM Size
 - 8K x 8
 
- Voltage - Supply (Vcc/Vdd)
 - 1.8V~3.6V
 
- uPs/uCs/Peripheral ICs Type
 - MICROCONTROLLER, RISC
 
- Core Processor
 - ARM® Cortex®-M0
 
- Peripherals
 - Brown-out Detect/Reset, POR, WDT
 
- Clock Frequency
 - 25MHz
 
- Program Memory Type
 - FLASH
 
- Core Size
 - 32-Bit
 
- Program Memory Size
 - 32KB 32K x 8
 
- Connectivity
 - I2C, SPI, UART/USART
 
- Bit Size
 - 32
 
- Has ADC
 - YES
 
- DMA Channels
 - NO
 
- PWM Channels
 - NO
 
- DAC Channels
 - NO
 
- Length
 - 7mm
 
- Height Seated (Max)
 - 1mm
 
- Width
 - 7mm
 
Download datasheets and manufacturer documentation for NXP LPC1114FHN33/301,5.
Datasheets:
Environmental Information:
LPC1114FHN33/301,5 Overview
The package is 32-VQFN Exposed Pad-shaped. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the LPC1100 series of electrical components. Having a size of 32KB 32K x 8, Microcontroller has a program memory of X bytes. A ARM® Cortex®-M0 Core Processor is at the core of this Microcontroller. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 33 has 33 terminations. 32-bits are used for its size. IC Chip has 3.3V volt supply outputs. With NO DMA channels, Microcontroller chip can handle large data transfers. Using the base part number LPC1114, you will be able to find alternatives for the part. Devices work in NO PWM channels. The pin count is 32. As far as its frequency goes, it operates according to a 25MHz clock.
LPC1114FHN33/301,5 Features
32-VQFN Exposed Pad package
Mounting type of Surface Mount
LPC1114FHN33/301,5 Applications
There are a lot of NXP USA Inc.
LPC1114FHN33/301,5 Microcontroller applications.
- Instrument control
 - Toys
 - Robots
 - Radio
 - Television
 - Heater/Fan
 - Calculator
 - Kindle
 - Christmas lights
 - 3D printers
 
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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