Rochester KSC2669OBU

Manufacturer No:

KSC2669OBU

Manufacturer:

Rochester

Package:

TO-226-3, TO-92-3 Short Body

Description:

NPN 150°C TJ 100nA ICBO 1 Elements 3 Terminations SILICON NPN TO-226-3, TO-92-3 Short Body Bulk Through Hole

Quantity:

In Stock :3864

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Shipping & Availability

Fast worldwide shipping via DHL, FedEx, UPS, and EMS.

Shipped from：HK Warehouse

Expected Shipping：Fri, May 29 - Sat, May 30, 2026

Lead Time：Inquire about availability

Date Code：Within 2 Years

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Quality Assurance

Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.

User Guide

Aichiplink operates certified in-house inspection and testing facilities to ensure all electronic components meet internationally recognized quality and compliance standards. Our quality management system is verified through ISO 9001 certification and industry-standard inspection procedures.

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

KSC2669OBU Information

Rochester KSC2669OBU technical specifications, attributes, parameters and parts with similar specifications to Rochester KSC2669OBU.

Type
Parameter

Mounting Type
Through Hole

Package / Case
TO-226-3, TO-92-3 Short Body

Surface Mount
NO

Transistor Element Material
SILICON

Operating Temperature
150°C TJ

Packaging
Bulk

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
1 (Unlimited)

Number of Terminations
3

Terminal Position
SINGLE

Type
Parameter

Reach Compliance Code
unknown

Pin Count
3

JESD-30 Code
R-PSIP-T3

Qualification Status
COMMERCIAL

Number of Elements
1

Configuration
SINGLE

Power - Max
200mW

Transistor Application
AMPLIFIER

Polarity/Channel Type
NPN

Transistor Type
NPN

Download datasheets and manufacturer documentation for Rochester KSC2669OBU.

Datasheets:

rochesterelectronicsllc-ksc900lbu-datasheets-4274.pdf

rochesterelectronicsllc-ksc1008cybu-datasheets-4139.pdf

KSC2669OBU Overview

The DC current gain is the ratio of the base current to the collector current ?dc = Ic/Ib and the DC current gain for this device is 70 @ 2mA 12V.Vce saturation means Ic is at its maximum value(saturated), and the vce saturation(Max) is 400mV @ 1mA, 10mA.A transition frequency of 250MHz is present in the part.A 30V maximal voltage - Collector Emitter Breakdown is present in the device.