

SAMSUNG KMQE10013M-B318
Manufacturer No:
KMQE10013M-B318
Manufacturer:
Package:
221 FBGA
Description:
Samsung KMQE10013M-B318: eMCP eMMC 16GB + LPDDR3 16Gb MV1616, EMCP Memory Chip KMQE60013M-B318 -16+16 EMCP D3 LPDDR3-1866MHz Memory Chip Storage
Quantity:


In Stock :1200
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User Guide
Aichiplink operates certified in-house inspection and testing facilities to ensure all electronic components meet internationally recognized quality and compliance standards. Our quality management system is verified through ISO 9001 certification and industry-standard inspection procedures.
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
KMQE10013M-B318 Information
SAMSUNG KMQE10013M-B318 technical specifications, attributes, parameters and parts with similar specifications to SAMSUNG KMQE10013M-B318.
- Type
- Parameter
- Applications
- Mobile
- eStorage Version
- eMMC 5.1
- eStorage Density
- 16 GB
- DRAM Type
- LPDDR3
- DRAM Density
- 16 Gb
- Package
- 221 FBGA
- Speed
- 1866 Mbps
- Product Status
- EOL
- Type
- Parameter
Download datasheets and manufacturer documentation for SAMSUNG KMQE10013M-B318.
Integrated to bring flagship performance
Equip mobile devices for the age of AI and 5G. DRAM and NAND come together in a single compact package to deliver flagship-level performance. LPDDR5 uMCP brings high-bandwidth storage and memory, crucial for the increasingly data-heavy demands of smartphones, wearables, and AI technology. Take less space and offer capabilities for the ever-growing 5G world.
The Samsung KMQE60013M-B318 is an embedded Multi-Chip Package (eMCP) that integrates both LPDDR3 DRAM and eMMC NAND flash storage into a single compact module. This design is particularly suited for space-constrained mobile and embedded applications.
Key Specifications
• DRAM: 16 Gb LPDDR3, operating at 1866 Mbps
• Storage: 16 GB eMMC 5.1
• Total eMCP Capacity: 32 GB (16 Gb DRAM + 16 GB NAND)
• Package Type: 221-ball FBGA
• Data Transfer Rate: Up to 200 MB/s
• Voltage: 1.2V for DRAM; 1.8V/3.3V for eMMC
• Operating Temperature: 0°C to 95°C
• Status: Discontinued (End-of-Life)
Applications
This eMCP is suitable for devices that require both memory and storage in a small footprint, such as:
• Smartphones
• Wearables
• IoT devices
• Microcontroller-based systems
KMQE10013M-B318 Relevant information
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