Samsung KLM8G1GETF-B041
Samsung KLM8G1GETF-B041Samsung KLM8G1GETF-B041Samsung KLM8G1GETF-B041

Samsung KLM8G1GETF-B041

Manufacturer No:

KLM8G1GETF-B041

Manufacturer:

Samsung

Package:

CARD

Description:

Samsung KLM8G1GETF-B041: MLC NAND Flash Serial e-MMC 3V/3.3V 64G-bit 64G/16G/8G x 1/4-bit/8-bit 153-Pin FBGA. With superior power efficiency and noticeably fast speed, Samsung’s eMMC is the definitive choice for flash storage to develop slim mobile design.

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

KLM8G1GETF-B041 information

Samsung KLM8G1GETF-B041 technical specifications, attributes, parameters and parts with similar specifications to Samsung KLM8G1GETF-B041.

  • Type
  • Parameter
  • Part Life Cycle Code
  • Active
  • Ihs Manufacturer
  • SAMSUNG SEMICONDUCTOR INC
  • Package Description
  • CARD
  • Reach Compliance Code
  • compliant
  • ECCN Code
  • EAR99
  • HTS Code
  • 8542.32.00.51
  • Date Of Intro
  • 2020-04-04
  • Samacsys Manufacturer
  • SAMSUNG
  • Additional Feature
  • 3.3V SUPPLY IS ALSO AVAILABLE
  • Length
  • 13 mm
  • Memory Density
  • 68719476736 bit
  • Memory IC Type
  • FLASH CARD
  • Memory Width
  • 8
  • Number of Functions
  • 1
  • Number of Words
  • 8589934592 words
  • Number of Words Code
  • 8000000000
  • Operating Mode
  • ASYNCHRONOUS
  • Operating Temperature-Max
  • 85 °C
  • Operating Temperature-Min
  • -25 °C
  • Organization
  • 8GX8
  • Package Style
  • GRID ARRAY
  • Programming Voltage
  • 1.8 V
  • Seated Height-Max
  • 0.8 mm
  • Supply Voltage-Nom (Vsup)
  • 1.8 V
  • Technology
  • CMOS
  • Temperature Grade
  • OTHER
  • Width
  • 11.5 mm

Download datasheets and manufacturer documentation for Samsung KLM8G1GETF-B041.

Samsung KLM8G1GETF-B041 Datasheet:

INTRODUCTION

 
 
SAMSUNG eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim
ple read and write to memory using MMC protocol v5.1 which is a industry standard.
 
 
eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply
voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG eMMC supports HS400 in order to improve sequential bandwidth, especially
sequential read performance.
 
 
There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to
faster product development as well as faster times to market.
 
 
The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
 
 

KEY FEATURES

 
 
• embedded MultiMediaCard Ver. 5.1 compatible.
• SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard
- Major Supported Features : HS400, Field Firmware Update, Cache, Command Queuing, Enhanced Strobe Mode,
Secure Write Protection, Partition types.
 
 
- Non-supported Features : Large Sector Size (4KB)
 
 
• Backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-eMMC systems)
• Data bus width : 1bit (Default), 4bit and 8bit
• MMC I/F Clock Frequency : 0 ~ 200MHz
• MMC I/F Boot Frequency : 0 ~ 52MHz
• Power : Interface power → VCCQ(1.70V ~ 1.95V) , Memory power → VCC (2.7V ~ 3.6V)

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.