SAMSUNG K4B2G1646C-HCH9

SAMSUNG K4B2G1646C-HCH9

Manufacturer No:

K4B2G1646C-HCH9

Manufacturer:

SAMSUNG

Description:

DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96,

DHL
DHL
DHL

In Stock :4648

Looking for price or availability? Send us an RFQ and our sales team will respond quickly.

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Shipped from：HK Warehouse
Expected Shipping：Thu, Oct 15 - Fri, Oct 16, 2026
Date Code：Within 2 Years

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All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.

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Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.

User Guide

Available from AS9120 Certified Supplier, AIChipLink delivers high-reliability electronic components supported by certified quality management, rigorous inspection processes, counterfeit mitigation controls, and full traceability systems. Our operations comply with AS9120, ISO 9001:2015, and IECQ ESD standards to support aerospace, industrial, defense, and mission-critical applications.

K4B2G1646C-HCH9 Information

SAMSUNG K4B2G1646C-HCH9 technical specifications, attributes, parameters and parts with similar specifications to SAMSUNG K4B2G1646C-HCH9.

  • Type
  • Parameter
  • RoHS Status
  • RoHS Compliant
  • Part Life Cycle Code
  • Obsolete
  • Ihs Manufacturer
  • SAMSUNG SEMICONDUCTOR INC
  • Reach Compliance Code
  • compliant
  • ECCN Code
  • EAR99
  • HTS Code
  • 8542.32.00.36
  • Access Time-Max
  • 0.255 ns
  • Clock Frequency-Max (fCLK)
  • 667 MHz
  • I/O Type
  • COMMON
  • Interleaved Burst Length
  • 4,8
  • Type
  • Parameter
  • JESD-30 Code
  • R-PBGA-B96
  • JESD-609 Code
  • e1
  • Memory Density
  • 2147483648 bit
  • Memory IC Type
  • DDR3 DRAM
  • Memory Width
  • 16
  • Moisture Sensitivity Level
  • 3
  • Number of Terminals
  • 96
  • Number of Words
  • 134217728 words
  • Number of Words Code
  • 128000000
  • Operating Temperature-Max
  • 85 °C

K4B2G1646C-HCH9 FAQ

Can I request a quote for K4B2G1646C-HCH9?

K4B2G1646C-HCH9 from SAMSUNG is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.

Why is pricing not shown as a fixed value for K4B2G1646C-HCH9?

The final price for K4B2G1646C-HCH9 depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.

Which specifications should I review for K4B2G1646C-HCH9?

K4B2G1646C-HCH9 is a SAMSUNG DRAM part. Key details include Time@Peak Reflow Temperature-Max (s): 30 and Peak Reflow Temperature (Cel): 260; contact us if you need the specifications verified before sourcing.

When will I receive a quotation for K4B2G1646C-HCH9?

After you submit the RFQ for K4B2G1646C-HCH9, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.

What is the expected shipping time for K4B2G1646C-HCH9?

Once stock for K4B2G1646C-HCH9 is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.

Can AIChipLink help find alternatives to K4B2G1646C-HCH9?

Yes. If K4B2G1646C-HCH9 is unavailable, end-of-life, or outside your schedule, we can review comparable SAMSUNG DRAM parts and compatible replacement options.