

INFINEON IRLML5103TR
Manufacturer No:
IRLML5103TR
Manufacturer:
Package:
TO-236-3, SC-59, SOT-23-3
Description:
MOSFET (Metal Oxide) P-Channel Cut Tape (CT) 600m ? @ 600mA, 10V 75pF @ 25V 5.1nC @ 10V 30V TO-236-3, SC-59, SOT-23-3
Quantity:


In Stock :1448
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IRLML5103TR Information
INFINEON IRLML5103TR technical specifications, attributes, parameters and parts with similar specifications to INFINEON IRLML5103TR.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- TO-236-3, SC-59, SOT-23-3
- Surface Mount
- YES
- Transistor Element Material
- SILICON
- Packaging
- Cut Tape (CT)
- Series
- HEXFET®
- Published
- 2003
- JESD-609 Code
- e3
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Type
- Parameter
- Number of Terminations
- 3
- ECCN Code
- EAR99
- Terminal Finish
- Matte Tin (Sn)
- Additional Feature
- LOGIC LEVEL COMPATIBLE
- HTS Code
- 8541.21.00.95
- Subcategory
- Other Transistors
- Technology
- MOSFET (Metal Oxide)
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
Download datasheets and manufacturer documentation for INFINEON IRLML5103TR.
Other Related Documents:
IRLML5103TR Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. To build a HEXFET Power MOSFET with the industry's smallest footprint, a bespoke leadframe has been put into the conventional SOT-23 packaging. The Micro3 package is designed for situations where printed circuit board space is limited. The Micro3's tiny profile (1.1mm) allows it to readily fit into ultra-thin application contexts like portable devices and PCMCIA cards.
IRLML5103TR Features
Advanced process technology
Dynamic dv/dt rating
Fast switching
Fully avalanche rated
IRLML5103TR Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
IRLML5103TR Relevant information
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