

INFINEON IRF7601TRPBF
Manufacturer No:
IRF7601TRPBF
Manufacturer:
Package:
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Description:
MOSFET (Metal Oxide) N-Channel Tape & Reel (TR) 35m ? @ 3.8A, 4.5V ±12V 650pF @ 15V 22nC @ 4.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Quantity:
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Step1:Prepare product

Step2:Desiccant Protection

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Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IRF7601TRPBF Information
INFINEON IRF7601TRPBF technical specifications, attributes, parameters and parts with similar specifications to INFINEON IRF7601TRPBF.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- Number of Pins
- 8
- Transistor Element Material
- SILICON
- Operating Temperature
- -55°C~150°C TJ
- Packaging
- Tape & Reel (TR)
- Series
- HEXFET®
- Published
- 1997
- Type
- Parameter
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 8
- ECCN Code
- EAR99
- Additional Feature
- ULTRA LOW RESISTANCE
- Technology
- MOSFET (Metal Oxide)
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Number of Elements
- 1
- Configuration
- SINGLE WITH BUILT-IN DIODE
Download datasheets and manufacturer documentation for INFINEON IRF7601TRPBF.
Datasheets:
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PCN Packaging:
ConflictMineralStatement:
Description
The IRF7601TRPBF is a HEXFET? Power MOSFET. International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to provide exceptionally low on-resistance per silicon area. This advantage gives the designer a highly efficient and dependable device for usage in a range of applications, together with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
The smallest footprint in a SOIC outline is offered by the new Micro8 package, which has a footprint area that is half that of the conventional SO-8. Since printed circuit board space is at a premium in these applications, the Micro8 is the perfect device. The Micro8 will be able to readily fit into extremely thin application contexts like portable electronics and PCMCIA cards thanks to its low profile (??1.1mm).
Features
Low Profile (??1.1mm)
Available in Tape&Reel
Fast Switching
Lead-Free
Generation V Technology
Ultra Low On-Resistance
N-Channel MOSFET
Very Small SOIC Package
Applications
Switch Mode Power Supplies (SMPS)
Power-Over-Ethernet (PoE)
Solar inverters.
Automotive applications
Switch, buck and synchronous rectification.
Uninterruptible Power Supplies (UPS)
Small motor control
IRF7601TRPBF Relevant information
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