

INFINEON IRF7389TRPBF
Manufacturer No:
IRF7389TRPBF
Manufacturer:
Package:
8-SOIC (0.154, 3.90mm Width)
Description:
Quantity:


In Stock :4488
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IRF7389TRPBF Information
INFINEON IRF7389TRPBF technical specifications, attributes, parameters and parts with similar specifications to INFINEON IRF7389TRPBF.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Contact Plating
- Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Number of Pins
- 8
- Transistor Element Material
- SILICON
- Operating Temperature
- -55°C~150°C TJ
- Packaging
- Tape & Reel (TR)
- Series
- HEXFET®
- Type
- Parameter
- Published
- 2004
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 8
- ECCN Code
- EAR99
- Resistance
- 29mOhm
- Additional Feature
- AVALANCHE RATED, ULTRA LOW RESISTANCE
- Max Power Dissipation
- 2.5W
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
Download datasheets and manufacturer documentation for INFINEON IRF7389TRPBF.
Other Related Documents:
PCN Packaging:
ConflictMineralStatement:
IRF7389TRPBF Description
In order to produce extraordinarily low on-resistance per silicon area, International Rectifier's Fifth Generation HEXFETs employ cutting-edge processing processes. With this benefit combined with the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are renowned for, the designe is given an incredibly efficient and dependable device for usage in a number of applications. Its improved thermal properties and multiple-die capacity make the SO-8 perfect for a variety of power applications. This modification was made possible by a specially designed leadframe. This advancement allows for the usage of many devices while drastically reducing the amount of board space needed. Vapor phase infrared, or wave soldering technology is intended for use with the packaging.
IRF7389TRPBF Features
Generating Technology V
Extremely Low On-Resistant
Offering a Free Half Bridge
The Surface Mount
Complete Avalanche Rating
Lead-Free
IRF7389TRPBF Applications
Switching applications
IRF7389TRPBF Relevant information
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