

INFINEON IRF5305STRRPBF
Manufacturer No:
IRF5305STRRPBF
Manufacturer:
Package:
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Description:
MOSFET (Metal Oxide) P-Channel Tape & Reel (TR) 60m ? @ 16A, 10V ±20V 1200pF @ 25V 63nC @ 10V 55V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Quantity:


In Stock :2363
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IRF5305STRRPBF Information
INFINEON IRF5305STRRPBF technical specifications, attributes, parameters and parts with similar specifications to INFINEON IRF5305STRRPBF.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Surface Mount
- YES
- Transistor Element Material
- SILICON
- Operating Temperature
- -55°C~175°C TJ
- Packaging
- Tape & Reel (TR)
- Series
- HEXFET®
- Published
- 2005
- JESD-609 Code
- e3
- Type
- Parameter
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 2
- ECCN Code
- EAR99
- Terminal Finish
- Matte Tin (Sn) - with Nickel (Ni) barrier
- Additional Feature
- LOGIC LEVEL COMPATIBLE, AVALANCHE RATED, HIGH RELIABILITY
- Subcategory
- Other Transistors
- Technology
- MOSFET (Metal Oxide)
- Terminal Position
- SINGLE
- Terminal Form
- GULL WING
Download datasheets and manufacturer documentation for INFINEON IRF5305STRRPBF.
Other Related Documents:
PCN Design/Specification:
PCN Assembly/Origin:
PCN Packaging:
IRF5305STRRPBF Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. The D2Pak is a surface mount power package that can fit die up to HEX-4 in size. It has the highest power capabilities and the lowest on-resistance of any surface mount package currently available. Because of its low internal connection resistance, the D2Pak is appropriate for high current applications and can dissipate up to 2.01N in a typical surface mount application. For low-profile applications, the through-hole variant (IRF5305L) is offered.
IRF5305STRRPBF Features
Lead-Free
P-Channel
Fast Switching
Fully Avalanche Rated
Surface Mount (I RF5305S)
Advanced Process Technology
175°C Operating Temperature
Low-profile through-hole (IR F5305L)
IRF5305STRRPBF Applications
Power Management
IRF5305STRRPBF Relevant information
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