STMicroelectronics IIS3DWBG1TR
Manufacturer No:
IIS3DWBG1TR
Manufacturer:
STMicroelectronics
Package:
Description:
Ultrawide bandwidth, low-noise, 3-axis digital vibration sensor with extended temperature range
Quantity:
In Stock :1287
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Expected Shipping：Sun, May 31 - Mon, Jun 1, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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IIS3DWBG1TR Information
STMicroelectronics IIS3DWBG1TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics IIS3DWBG1TR.
- Type
- Parameter
- Operating Range
- Industrial
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 125.0
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.86 mm
- Operating Range
- Industrial
- Type
- Parameter
- Operating Temp Min Celsius
- -40.0
- Operating Temp Max Celsius
- 125.0
- ECCN US
- EAR99
- ECCN EU
- NEC
- Packing Type
- Tape And Reel
- RoHS Status
- Grade
- Industrial
- Package Name
- LGA 14L 2.5x3x0.86 mm
Download datasheets and manufacturer documentation for STMicroelectronics IIS3DWBG1TR.
Data sheet:
The IIS3DWBG1 is a system-in-package featuring a 3-axis digital vibration sensor with low noise over an ultrawide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +125°C), make the device particularly suitable for vibration monitoring in industrial applications and electric or hybrid vehicles.
The high performance delivered at low power consumption together with the digital output and the embedded digital features like the FIFO and the interrupts are enabling features for battery-operated industrial wireless sensor nodes.
The IIS3DWBG1 has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring accelerations with a bandwidth up to 6 kHz with an output data rate of 26.7 kHz. A 3 KB first-in, first-out (FIFO) buffer is integrated in the device to avoid any data loss and to limit intervention from the host processor.
The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial, and consumer markets. The sensing elements are manufactured using ST’s proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology.
The IIS3DWBG1 has a self-test capability, which allows checking the functioning of the sensor in the final application. The IIS3DWBG1 is available in a 14-lead plastic, land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40°C to +125°C.
- 3-axis vibration sensor with digital output
- User-selectable full scale: ±2/±4/±8/±16 g
- Ultrawide and flat frequency response range: from dc to 6 kHz (±3 dB point)
- Ultralow noise density: down to 75 µg/√Hz in 3-axis mode / 60 µg/√Hz in single-axis mode
- High stability of the sensitivity over temperature and against mechanical shocks
- Extended temperature range from -40 to +125°C
- Low power: 1.1 mA with all 3 axes delivering full performance
- SPI serial interface
- Low-pass or high-pass filter with selectable cutoff frequency
- Interrupts for wake-up / activity - inactivity / FIFO thresholds
- Embedded FIFO: 3 KB
- Embedded temperature sensor
- Embedded self-test
- Supply voltage: 2.1 V to 3.6 V
- Compact package: LGA-14L, 2.5 x 3 x 0.83 mm
- ECOPACK and RoHS compliant
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