Renesas IDT71V3577SA75BGG
Manufacturer No:
IDT71V3577SA75BGG
Manufacturer:
Renesas
Package:
BGA
Description:
119 Pin Memory IC 22mm mm
Quantity:
In Stock :8236
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Shipped from：HK Warehouse
Expected Shipping：Sat, May 30 - Sun, May 31, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IDT71V3577SA75BGG Information
Renesas IDT71V3577SA75BGG technical specifications, attributes, parameters and parts with similar specifications to Renesas IDT71V3577SA75BGG.
- Type
- Parameter
- Package / Case
- BGA
- Surface Mount
- YES
- Published
- 2005
- JESD-609 Code
- e1
- Number of Terminations
- 119
- ECCN Code
- 3A991.B.2.A
- Terminal Finish
- TIN SILVER COPPER
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Additional Feature
- FLOW-THROUGH ARCHITECTURE
- Type
- Parameter
- HTS Code
- 8542.32.00.41
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 1.27mm
- Reach Compliance Code
- unknown
- Pin Count
- 119
- Qualification Status
- Not Qualified
Download datasheets and manufacturer documentation for Renesas IDT71V3577SA75BGG.
IDT71V3577SA75BGG Overview
A RAM, SRAM-type memory can be classified as the memory type of this device. Embedded in the BGA case, memory ics is a single file. A total of 119 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. The memory device in question has 119 pins, thus indicating that it has 119 memory locations that can be accessed. This chip features all the merits of a conventional chip, but it also features FLOW-THROUGH ARCHITECTURE to improve system performance. There must not be a minimum operating temperature of less than 0°C for this device. A temperature of no more than 70°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component.
IDT71V3577SA75BGG Features
Package / Case: BGA
Additional Feature:FLOW-THROUGH ARCHITECTURE
IDT71V3577SA75BGG Applications
There are a lot of Integrated Device Technology (IDT)
IDT71V3577SA75BGG Memory applications.
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
- Camcorders
- embedded logic
- eDRAM
- graphics card
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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