Renesas IDT71V3557SA75BGG
Manufacturer No:
IDT71V3557SA75BGG
Manufacturer:
Renesas
Package:
BGA
Description:
3.3V V 119 Pin Memory IC 22mm mm
Quantity:
In Stock :9818
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Shipped from：HK Warehouse
Expected Shipping：Sat, May 30 - Sun, May 31, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step2：Desiccant Protection
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Step6：Packaging Box
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1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IDT71V3557SA75BGG Information
Renesas IDT71V3557SA75BGG technical specifications, attributes, parameters and parts with similar specifications to Renesas IDT71V3557SA75BGG.
- Type
- Parameter
- Package / Case
- BGA
- Surface Mount
- YES
- Published
- 2009
- JESD-609 Code
- e1
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 119
- ECCN Code
- 3A991.B.2.A
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Type
- Parameter
- Additional Feature
- FLOW-THROUGH ARCHITECTURE
- HTS Code
- 8542.32.00.41
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 1.27mm
Download datasheets and manufacturer documentation for Renesas IDT71V3557SA75BGG.
IDT71V3557SA75BGG Overview
As far as memory types are concerned, RAM, SRAM is considered to be its memory type. In the case of BGA, it is embedded within the case. On the chip, there are 119 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. In the memory, there is a clock frequency rotation that ranges 100MHz. I have noticed that the memory device has 119 pins, which indicates that it has 119 locations in the memory. The memory chip also offers FLOW-THROUGH ARCHITECTURE to level up system performance despite its merits. There is only a single power supply required for this memory chip. There are I/O ports on this memory ics that have COMMON-bit memory mapping. Temperatures below 0°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 70°C, otherwise damage to the part may occur as a result of overheating. As far as the supply current is concerned, it can be operated with a maximum of 0.275mA of currentIn most cases, this memory ics is regarded as being a type of SRAMs.
IDT71V3557SA75BGG Features
Package / Case: BGA
Additional Feature:FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON
IDT71V3557SA75BGG Applications
There are a lot of Integrated Device Technology (IDT)
IDT71V3557SA75BGG Memory applications.
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
- Camcorders
- embedded logic
- eDRAM
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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