Renesas IDT71T75602S200BGGI8
Manufacturer No:
IDT71T75602S200BGGI8
Manufacturer:
Renesas
Package:
BGA
Description:
2.5V V 119 Pin Memory IC 22mm mm
Quantity:
In Stock :5543
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Tue, Jun 2 - Wed, Jun 3, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IDT71T75602S200BGGI8 Information
Renesas IDT71T75602S200BGGI8 technical specifications, attributes, parameters and parts with similar specifications to Renesas IDT71T75602S200BGGI8.
- Type
- Parameter
- Package / Case
- BGA
- Surface Mount
- YES
- Packaging
- Tape & Reel (TR)
- Published
- 2010
- JESD-609 Code
- e1
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 119
- ECCN Code
- 3A991.B.2.A
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- Max Operating Temperature
- 85°C
- Type
- Parameter
- Min Operating Temperature
- -40°C
- Additional Feature
- PIPELINED ARCHITECTURE
- HTS Code
- 8542.32.00.41
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Number of Functions
- 1
- Supply Voltage
- 2.5V
Download datasheets and manufacturer documentation for Renesas IDT71T75602S200BGGI8.
IDT71T75602S200BGGI8 Overview
RAM, SRAM is the type of memory it has. There is a Tape & Reel (TR) case available. The BGA case contains it. The chip has 119 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 2.5V of power. There are 119 pins on this memory device, which indicates it has 119 memory locations in it. Despite all its merits, this chip also features PIPELINED ARCHITECTURE to boost system performance. When it comes to power supplies, this memory chip only requires 2.5V . I/O port addresses on this device are mapped to memory addresses of COMMON bits. This device must operate at a minimum temperature of -40°C. Temperatures no higher than 85°C degrees Celsius are recommended for operation. It is usually considered a type of SRAMs component. Data is processed by this memory ics at a frequency of 200MHz.
IDT71T75602S200BGGI8 Features
Package / Case: BGA
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 200MHz
200MHz terminals
IDT71T75602S200BGGI8 Applications
There are a lot of Integrated Device Technology (IDT)
IDT71T75602S200BGGI8 Memory applications.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
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12.28 M
Listed Part Number
3,000+
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4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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