Renesas IDT70V7339S133DDI
Manufacturer No:
IDT70V7339S133DDI
Manufacturer:
Renesas
Package:
TQFP
Description:
2.5/3.33.3V V 144 Pin Memory IC 20mm mm
Quantity:
In Stock :7610
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Shipping & Availability
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Shipped from：HK Warehouse
Expected Shipping：Wed, Jun 3 - Thu, Jun 4, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
IDT70V7339S133DDI Information
Renesas IDT70V7339S133DDI technical specifications, attributes, parameters and parts with similar specifications to Renesas IDT70V7339S133DDI.
- Type
- Parameter
- Package / Case
- TQFP
- Surface Mount
- YES
- Published
- 2008
- JESD-609 Code
- e0
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 144
- ECCN Code
- 3A991.B.2.A
- Terminal Finish
- Tin/Lead (Sn85Pb15)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- -40°C
- Type
- Parameter
- Additional Feature
- FLOW-THROUGH OR PIPELINED ARCHITECTURE
- HTS Code
- 8542.32.00.41
- Subcategory
- SRAMs
- Technology
- CMOS
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 225
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 0.5mm
Download datasheets and manufacturer documentation for Renesas IDT70V7339S133DDI.
IDT70V7339S133DDI Overview
A RAM, SRAM-type memory can be classified as the memory type of this device. Embedded in the TQFP case, memory ics is a single file. A total of 144 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. The memory device in question has 144 pins, thus indicating that it has 144 memory locations that can be accessed. This chip features all the merits of a conventional chip, but it also features FLOW-THROUGH OR PIPELINED ARCHITECTURE to improve system performance. 2 ports allow read/write access to one memory address in this chip. As for power supplies, this memory chip requires just 2.5/3.33.3V . As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than -40°C for this device. A temperature of no more than 85°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. In order to operate your device, you will need to provide a maximum supply current of 0.675mA. Usually, this memory ics falls under the SRAMs component category. A frequency of 133MHz is used to process the data on this memory chip.
IDT70V7339S133DDI Features
Package / Case: TQFP
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals
IDT70V7339S133DDI Applications
There are a lot of Integrated Device Technology (IDT)
IDT70V7339S133DDI Memory applications.
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
- Camcorders
- embedded logic
- eDRAM
- graphics card
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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