H&D Wireless AB HDG200-DN-3
H&D Wireless AB HDG200-DN-3

H&D Wireless AB HDG200-DN-3

Manufacturer No:

HDG200-DN-3

Manufacturer:

H&D Wireless AB

Package:

44-TQFN Exposed Pad Module

Description:

TxRx + MCU 2.4GHz 2.75V~3.6V SDIO, SPI 72.2Mbps 49mA - Receiving 197mA - Transmitting 1kB EEPROM 160kB SRAM 44-TQFN Exposed Pad Module

User Guide

Aichiplink operates certified in-house inspection and testing facilities to ensure all electronic components meet internationally recognized quality and compliance standards. Our quality management system is verified through ISO 9001 certification and industry-standard inspection procedures.

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

HDG200-DN-3 Information

H&D Wireless AB HDG200-DN-3 technical specifications, attributes, parameters and parts with similar specifications to H&D Wireless AB HDG200-DN-3.

  • Type
  • Parameter
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 44-TQFN Exposed Pad Module
  • Supplier Device Package
  • 44-QFN SIP (8x8)
  • Operating Temperature
  • -40°C~85°C
  • Packaging
  • Tray
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Type
  • TxRx + MCU
  • Max Operating Temperature
  • 85°C
  • Min Operating Temperature
  • -40°C
  • Type
  • Parameter
  • Voltage - Supply
  • 2.75V~3.6V
  • Frequency
  • 2.4GHz
  • Interface
  • SDIO, SPI
  • Memory Size
  • 1kB EEPROM 160kB SRAM
  • Protocol
  • 802.11b/g/n
  • Power - Output
  • 17dBm
  • RF Family/Standard
  • WiFi
  • Data Rate (Max)
  • 72.2Mbps
  • Serial Interfaces
  • SDIO, SPI
  • Current - Receiving
  • 49mA

Download datasheets and manufacturer documentation for H&D Wireless AB HDG200-DN-3.

HDG200-DN-3 Overview


44-TQFN Exposed Pad Module package saves space on the board. It is possible to mount the RF transceiver's mounting using Surface Mount.It is highly performing and reliable when it emerges as a TxRx + MCU.A high level of reliability is provided by using an advanced transceiver RF' packaging Tray.As a result, RF transceiver operates on the basis of frequency 2.4GHz.

HDG200-DN-3 Features


44-TQFN Exposed Pad Module package
Surface Mount for mounting
TxRx + MCU
Tray is used


HDG200-DN-3 Applications


There are a lot of H&D Wireless AB
HDG200-DN-3 RF Transceiver ICs applications.


  • Security Systems
  • M2M Communication
  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
  • Transmit
  • Receive
  • Switch

In Stock :Available

Looking for price or availability? Send us an RFQ and our sales team will respond quickly.

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Shipping & Availability

DHL
EMS
FedEx
UPS

Fast worldwide shipping via DHL, FedEx, UPS, and EMS.

Shipped from:HK Warehouse
Expected Shipping:Mon, Mar 16 - Tue, Mar 17, 2026
Date Code:Within 2 Years

Payment

PayPal
MasterCard
Visa
American Express

We support multiple secure payment methods including PayPal, Visa, MasterCard, and American Express. All transactions are protected with advanced encryption to ensure secure and reliable payments.

Authenticity Guarantee

All components supplied by Aichiplink are sourced from trusted global suppliers and verified through strict in-house inspection and quality control procedures.

Quality Assurance

Certified in-house inspection and testing facilities ensure all components meet internationally recognized quality standards.