

Renesas HC5513BIM
Manufacturer No:
HC5513BIM
Manufacturer:
Package:
DIP
Description:
28 Terminations Telecom device 1 Circuits 1 Functions
Quantity:
Delivery:




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In Stock :Available
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HC5513BIM information
Renesas HC5513BIM technical specifications, attributes, parameters and parts with similar specifications to Renesas HC5513BIM.
- Type
- Parameter
- Mount
- Through Hole
- Package / Case
- DIP
- Published
- 2000
- JESD-609 Code
- e0
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 28
- Terminal Finish
- Tin/Lead (Sn/Pb)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- -40°C
- Subcategory
- Analog Transmission Interfaces
- Technology
- BIPOLAR
- Terminal Position
- QUAD
- Terminal Form
- J BEND
- Peak Reflow Temperature (Cel)
- 225
- Number of Functions
- 1
- Supply Voltage
- 5V
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- S-PQCC-J28
- Qualification Status
- Not Qualified
- Power Supplies
- +-5V
- Temperature Grade
- INDUSTRIAL
- Number of Circuits
- 1
- Power Dissipation-Max
- 1.5W
- Operating Supply Current
- 2.25mA
- Neg Supply Voltage-Nom
- -5V
- Battery Feed
- CONSTANT CURRENT
- Hybrid
- 2-4 CONVERSION
- Battery Supply
- -28 V
- Height Seated (Max)
- 4.57mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for Renesas HC5513BIM.
Datasheets:
HC5513BIM Overview
DIP package is used to save board space.This telecom IC is composed of 1 circuits.Telecom switching is mounted in the way of Through Hole.There are 28 terminations can be found in telecom switching configuration.The supply voltage it operates with is 5V.It adopts SLIC as its telecom IC type.Telecom product operates with the supply current of 2.25mA to provide much flexibility for designers.Telecommunications device belongs to the subcategory of Analog Transmission Interfaces.The temperature is set at the minimum value of -40°C to ensure normal operation.The temperature is set at the maximum value of 85°C to ensure normal operation.Telecommunications device is configured wit h 1 functions when designing.
HC5513BIM Features
Available in the DIP package
SLIC as telecom IC type
Operating supply current of 2.25mA
HC5513BIM Applications
There are a lot of Intersil (Renesas Electronics America)
HC5513BIM Telecom applications.
- High-Density T1/E1/J1 interfaces for Multiplexers
- Switches
- LAN Routers
- Digital Modems
- SONET/SDH terminal
- Add/Drop multiplexers (ADMs)
- T1/E1/J1 add/drop multiplexers (MUX)
- Channel Service Units (CSUs): T1/E1/J1
- Fractional T1/E1/J1
- BITS Timing
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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