INTEL HC1S30F780NAE
Manufacturer No:
HC1S30F780NAE
Manufacturer:
INTEL
Package:
780-BBGA, FCBGA
Description:
FPGAs Stratix® HardCopy® Series 780-BBGA, FCBGA
Quantity:
In Stock :6266
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Shipping & Availability
Fast worldwide shipping via DHL, FedEx, UPS, and EMS.
Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
HC1S30F780NAE Information
INTEL HC1S30F780NAE technical specifications, attributes, parameters and parts with similar specifications to INTEL HC1S30F780NAE.
- Type
- Parameter
- Mounting Type
- Surface Mount
- Package / Case
- 780-BBGA, FCBGA
- Supplier Device Package
- 780-FBGA (29x29)
- Packaging
- Tray
- Series
- Stratix® HardCopy®
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Voltage - Supply
- 1.425V~1.575V
- Number of I/O
- 597
- Number of Logic Elements/Cells
- 32470
- Type
- Parameter
- Total RAM Bits
- 2137536
- Number of LABs/CLBs
- 3247
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for INTEL HC1S30F780NAE.
Datasheets:
HC1S30F780NAE Overview
There is a 780-BBGA, FCBGA package that includes this component. 597 I/Os are available for transferring data more efficiently. A fundamental building block consists of 32470 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. As part of the Stratix® HardCopy® series of FPGAs, it is a type of FPGA. As a space-saving measure, this FPGA model is contained within Tray. There are 2137536 RAM bits that are available with this device. 3247 LABs and CLBs are built into this FPGA. There is a device package provided by 780-FBGA (29x29) as its supplier.
HC1S30F780NAE Features
597 I/Os
Up to 2137536 RAM bits
HC1S30F780NAE Applications
There are a lot of Intel
HC1S30F780NAE FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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