INTEL EPM2210GF324C5
Manufacturer No:
EPM2210GF324C5
Manufacturer:
INTEL
Package:
324-BGA
Description:
1.5/3.31.8V 1mm PMIC MAX® II Series EPM2210 1.8V 324-BGA
Quantity:
In Stock :4697
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Shipped from：HK Warehouse
Expected Shipping：Thu, Jun 11 - Fri, Jun 12, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM2210GF324C5 Information
INTEL EPM2210GF324C5 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210GF324C5.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 324-BGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- MAX® II
- JESD-609 Code
- e0
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 324
- ECCN Code
- 3A991
- Terminal Finish
- TIN LEAD
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 220
Download datasheets and manufacturer documentation for INTEL EPM2210GF324C5.
Datasheets:
EPM2210GF324C5 Overview
A mobile phone network consists of 1700macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).324-BGA is the package in which it resides.There are 272 I/Os programmed in it.The device is programmed with 324 terminations.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers and freight.Power is provided by a supply voltage of 1.8V volts.It is included in Programmable Logic Devices.As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to 0°C~85°C TJ.The chip should be mounted by Surface Mount.It belongs to the MAX® IIseries of FPGAs.When using this device, YES can also be found.The EPM2210 indicates that its related parts can be found.There are 2210 logic elements/blocks.The system runs on a power supply of 1.5/3.31.8V watts.In this case, the maximum supply voltage (Vsup) reaches 1.89V.It is recommended that the supply voltage (Vsup) be greater than 1.71V.
EPM2210GF324C5 Features
324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM2210GF324C5 Applications
There are a lot of Intel
EPM2210GF324C5 CPLDs applications.
- Voltage level translation
- Timing control
- Interface bridging
- I/O expansion
- Discrete logic functions
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
