INTEL EPM2210GF256C5
Manufacturer No:
EPM2210GF256C5
Manufacturer:
INTEL
Package:
256-BGA
Description:
1.5/3.31.8V 1mm PMIC MAX® II Series EPM2210 1.8V 256-BGA
Quantity:
In Stock :4658
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Shipped from：HK Warehouse
Expected Shipping：Mon, Jun 8 - Tue, Jun 9, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM2210GF256C5 Information
INTEL EPM2210GF256C5 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210GF256C5.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- MAX® II
- JESD-609 Code
- e0
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 256
- ECCN Code
- 3A991
- Terminal Finish
- TIN LEAD
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 220
Download datasheets and manufacturer documentation for INTEL EPM2210GF256C5.
Datasheets:
EPM2210GF256C5 Overview
Currently, there are 1700 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.There is a 256-BGA package containing it.There are 204 I/Os on the board.Terminations of devices are set to 256.BOTTOM is the terminal position of this electrical part.A voltage of 1.8Vprovides power to the device.There is a part in the family Programmable Logic Devices.It is recommended that the chip be packaged by Tray.The device operates at a temperature of 0°C~85°C TJ in order to ensure its reliability.Ideally, the chip should be mounted by Surface Mount.The MAX® II series FPGA is one of these types.If you use this device, you will also find YES.The EPM2210 can be used to identify its related parts.In total, there are 2210 logic elements/blocks.A power supply of 1.5/3.31.8V is required to operate it.In this case, the maximum supply voltage (Vsup) is 1.89V.Vsup (supply voltage) must be greater than 1.71V.
EPM2210GF256C5 Features
256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM2210GF256C5 Applications
There are a lot of Intel
EPM2210GF256C5 CPLDs applications.
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
- Handheld digital devices
- Battery operated portable devices
- Complex programmable logic devices
- Digital designs
- Field programmable gate
AIChipLink – Your Trusted Electronic Components Distributor
12.28 M
Listed Part Number
3,000+
Leading Manufacturers
4.9 M
In-stock SKU
15,000+
Warehouse Area(㎡)
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