

INTEL EPM2210GF256C3
Manufacturer No:
EPM2210GF256C3
Manufacturer:
Package:
256-BGA
Description:
1.5/3.31.8V 1mm PMIC MAX® II Series EPM2210 1.8V 256-BGA
Quantity:
Delivery:




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In Stock :Available
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EPM2210GF256C3 information
INTEL EPM2210GF256C3 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210GF256C3.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- MAX® II
- JESD-609 Code
- e0
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- ECCN Code
- 3A991
- Terminal Finish
- TIN LEAD
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 220
- Supply Voltage
- 1.8V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- EPM2210
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 1.89V
- Power Supplies
- 1.5/3.31.8V
- Supply Voltage-Min (Vsup)
- 1.71V
- Programmable Type
- In System Programmable
- Number of I/O
- 204
- Propagation Delay
- 7 ns
- Output Function
- MACROCELL
- Number of Macro Cells
- 1700
- JTAG BST
- YES
- Voltage Supply - Internal
- 1.71V~1.89V
- Delay Time tpd(1) Max
- 7ns
- Number of Logic Elements/Blocks
- 2210
- Length
- 17mm
- Height Seated (Max)
- 2.2mm
- Width
- 17mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for INTEL EPM2210GF256C3.
Datasheets:
EPM2210GF256C3 Overview
1700 macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.A 256-BGA package contains the item.This device has 204 I/O ports programmed into it.It is programmed that device terminations will be 256 .The terminal position of this electrical component is BOTTOM.A voltage of 1.8V is used as the power supply for this device.It is a part of family Programmable Logic Devices.It is recommended to package the chip by Tray.During operation, the operating temperature is kept at 0°C~85°C TJ to ensure its reliability.Mount the chip by Surface Mount.This type of FPGA is a part of the MAX® II series.If this device is used, you will also be able to find YES.There are related parts in EPM2210.This logic element/block contains 2210 logic elements.It runs on 1.5/3.31.8V volts of power.In order to ensure proper operation, a maximum supply voltage (Vsup) of 1.89V is required.It is important that the supply voltage (Vsup) exceeds 1.71VV.
EPM2210GF256C3 Features
256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM2210GF256C3 Applications
There are a lot of Intel
EPM2210GF256C3 CPLDs applications.
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
- Handheld digital devices
- Battery operated portable devices
- Complex programmable logic devices
- Digital designs
- Field programmable gate
- Address decoding
User Guide
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