INTEL EPM2210GF256C3
Manufacturer No:
EPM2210GF256C3
Manufacturer:
INTEL
Package:
256-BGA
Description:
1.5/3.31.8V 1mm PMIC MAX® II Series EPM2210 1.8V 256-BGA
Quantity:
In Stock :3517
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Shipped from：HK Warehouse
Expected Shipping：Tue, Jun 16 - Wed, Jun 17, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
EPM2210GF256C3 Information
INTEL EPM2210GF256C3 technical specifications, attributes, parameters and parts with similar specifications to INTEL EPM2210GF256C3.
- Type
- Parameter
- Factory Lead Time
- 8 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 256-BGA
- Surface Mount
- YES
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- MAX® II
- JESD-609 Code
- e0
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Type
- Parameter
- Number of Terminations
- 256
- ECCN Code
- 3A991
- Terminal Finish
- TIN LEAD
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 220
Download datasheets and manufacturer documentation for INTEL EPM2210GF256C3.
Datasheets:
EPM2210GF256C3 Overview
1700 macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.A 256-BGA package contains the item.This device has 204 I/O ports programmed into it.It is programmed that device terminations will be 256 .The terminal position of this electrical component is BOTTOM.A voltage of 1.8V is used as the power supply for this device.It is a part of family Programmable Logic Devices.It is recommended to package the chip by Tray.During operation, the operating temperature is kept at 0°C~85°C TJ to ensure its reliability.Mount the chip by Surface Mount.This type of FPGA is a part of the MAX® II series.If this device is used, you will also be able to find YES.There are related parts in EPM2210.This logic element/block contains 2210 logic elements.It runs on 1.5/3.31.8V volts of power.In order to ensure proper operation, a maximum supply voltage (Vsup) of 1.89V is required.It is important that the supply voltage (Vsup) exceeds 1.71VV.
EPM2210GF256C3 Features
256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies
EPM2210GF256C3 Applications
There are a lot of Intel
EPM2210GF256C3 CPLDs applications.
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
- Handheld digital devices
- Battery operated portable devices
- Complex programmable logic devices
- Digital designs
- Field programmable gate
- Address decoding
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12.28 M
Listed Part Number
3,000+
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In-stock SKU
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